Patents by Inventor Xilong Wang
Xilong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250206716Abstract: The present invention relates to a crystal form of Vonoprazan pyroglutamate and a preparation method therefor. The crystal form of Vonoprazan pyroglutamate obtained in the present invention not only has good solubility, but also has excellent storage stability. The in vitro activity experiments have shown that the inhibitory effect of the crystal form I of the present invention on H+K+-ATPase is equivalent to that of TAK-438. The animal experiments have shown that the crystal form of the present invention can significantly inhibit histamine-induced secretion of stomach acid in rats via intravenous administration, and can exert the efficacy faster than the duodenal administration of TAK-438.Type: ApplicationFiled: November 10, 2022Publication date: June 26, 2025Applicants: HARWAY PHARMA CO., LTD, HARWAY (WEIFANG) PHARMACEUTICAL TECHNOLOGY CO., LTDInventors: Weiguo SONG, Xilong WANG, Zongqing JIA, Fahui LI, Chenggang SONG, Mingjie XU, Yujing QIAO
-
TRANSISTOR AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number: 20240179922Abstract: Embodiments provide a transistor and a method for manufacturing same, a semiconductor device and a method for manufacturing same. The method for manufacturing a transistor includes operations. A wafer is provided, the wafer has multiple transistor formation regions, each of which has a transistor pillar with an exposed gate formation surface. A gate oxide layer and a gate are sequentially formed on the gate formation surface of each of the transistor pillars. A source is formed at a first end of each of the transistor pillars. A drain is formed at a second end of each of the transistor pillars, here the first end and the second end are opposite ends of each of the transistor pillars in a first direction which is a thickness direction of the wafer; a part of each of the transistor pillars between the source and the drain forms a channel region of the transistor.Type: ApplicationFiled: August 6, 2021Publication date: May 30, 2024Applicant: ICLEAGUE TECHNOLOGY CO., LTD.Inventors: Wenyu HUA, Xilong WANG -
Patent number: 11107856Abstract: A manufacturing method of an image sensing device includes the following steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A passivation layer is formed on the substrate. An auxiliary layer is formed on the passivation layer. A material composition of the auxiliary layer is different from a material composition of the passivation layer. An annealing process is performed to the substrate and the passivation layer. The passivation layer is covered by the auxiliary layer during the annealing process. The auxiliary layer is removed after the annealing process. The ability to constrain and/or passivate free charge in and/or near the passivation layer may be enhanced by performing the annealing process with the auxiliary layer covering the passivation layer. The electrical performance of the image sensing device may be improved accordingly.Type: GrantFiled: September 15, 2019Date of Patent: August 31, 2021Assignee: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.Inventors: Peng Sun, Xilong Wang, Sheng Hu
-
Patent number: 10840085Abstract: The invention discloses a method for improving bonding of dangling bonds of silicon atoms. A surface of a wafer is oxidized to form a silicon oxide layer. The upper surface of the silicon oxide layer has a dangling bond. A dielectric layer is disposed on the upper surface of the silicon oxide layer, which is then subjected to an oxygen-enriched oxidation treatment at a preset first temperature. A protective layer is disposed on the upper surface of the dielectric layer. The wafer is then subjected to an annealing treatment. By passing oxidizing gas through the surface of the protective layer, oxygen ions in the oxidizing gas penetrate the dielectric layer to reach wafer surface. After high-temperature annealing treatment, the unsaturated bonds of the silicon atoms are bonded to the oxygen ions on the wafer surface, thereby improving the bonding of the dangling bonds on the wafer surface.Type: GrantFiled: March 12, 2019Date of Patent: November 17, 2020Assignee: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.Inventors: Xilong Wang, Sheng Hu, Wen Zou
-
Publication number: 20200013824Abstract: A manufacturing method of an image sensing device includes the following steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A passivation layer is formed on the substrate. An auxiliary layer is formed on the passivation layer. A material composition of the auxiliary layer is different from a material composition of the passivation layer. An annealing process is performed to the substrate and the passivation layer. The passivation layer is covered by the auxiliary layer during the annealing process. The auxiliary layer is removed after the annealing process. The ability to constrain and/or passivate free charge in and/or near the passivation layer may be enhanced by performing the annealing process with the auxiliary layer covering the passivation layer. The electrical performance of the image sensing device may be improved accordingly.Type: ApplicationFiled: September 15, 2019Publication date: January 9, 2020Inventors: PENG SUN, XILONG WANG, SHENG HU
-
Publication number: 20190333762Abstract: The invention discloses a method for improving bonding of dangling bonds of silicon atoms. A surface of a wafer is oxidized to form a silicon oxide layer. The upper surface of the silicon oxide layer has a dangling bond. A dielectric layer is disposed on the upper surface of the silicon oxide layer, which is then subjected to an oxygen-enriched oxidation treatment at a preset first temperature. A protective layer is disposed on the upper surface of the dielectric layer. The wafer is then subjected to an annealing treatment. By passing oxidizing gas through the surface of the protective layer, oxygen ions in the oxidizing gas penetrate the dielectric layer to reach wafer surface. After high-temperature annealing treatment, the unsaturated bonds of the silicon atoms are bonded to the oxygen ions on the wafer surface, thereby improving the bonding of the dangling bonds on the wafer surface.Type: ApplicationFiled: March 12, 2019Publication date: October 31, 2019Inventors: XILONG WANG, SHENG HU, WEN ZOU
-
Patent number: 7753075Abstract: The Invention relates to an upwardly and downwardly discharged faucet for comfortable use, comprising a main handle and a main valve body. The main valve body is provided with a diverting valve with dual ports. The diverting valve comprises a valve seat mounted on the main valve body. On the bottom side wall of the valve seat are disposed a left inlet and right inlet which are in communication with a main conduit, respectively. Within a chamber is disposed a diverting valve core, in which an upper water conduit and a lower water conduit are disposed. The upper water conduit is in adjustable communication with the right inlet; and the lower water conduit is in adjustable communication with the left inlet. The outlet of the lower water conduit is in communication with the bottom of the chamber. On the upper end of the diverting valve core is provided a rotary valve stem.Type: GrantFiled: June 23, 2005Date of Patent: July 13, 2010Inventors: Bigui Lin, Xilong Wang
-
Publication number: 20080142101Abstract: The Invention relates to an upwardly and downwardly discharged faucet for comfortable use, comprising a main handle and a main valve body. The main valve body is provided with a diverting valve with dual ports. The diverting valve comprises a valve seat mounted on the main valve body. On the bottom side wall of the valve seat are disposed a left inlet and right inlet which are in communication with a main conduit, respectively. Within a chamber is disposed a diverting valve core, in which an upper water conduit and a lower water conduit are disposed. The upper water conduit is in adjustable communication with the right inlet; and the lower water conduit is in adjustable communication with the left inlet. The outlet of the lower water conduit is in communication with the bottom of the chamber. On the upper end of the diverting valve core is provided a rotary valve stem.Type: ApplicationFiled: June 23, 2005Publication date: June 19, 2008Inventors: Bigui Lin, Xilong Wang
-
Patent number: D905511Type: GrantFiled: May 13, 2019Date of Patent: December 22, 2020Assignee: SHENZHEN ZHIYUAN TECH CO., LTD.Inventor: Xilong Wang
-
Patent number: D958572Type: GrantFiled: December 25, 2020Date of Patent: July 26, 2022Assignee: SHENZHEN ZHIYUAN TECH CO., LTDInventor: Xilong Wang