Patents by Inventor Xilong Wang

Xilong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107856
    Abstract: A manufacturing method of an image sensing device includes the following steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A passivation layer is formed on the substrate. An auxiliary layer is formed on the passivation layer. A material composition of the auxiliary layer is different from a material composition of the passivation layer. An annealing process is performed to the substrate and the passivation layer. The passivation layer is covered by the auxiliary layer during the annealing process. The auxiliary layer is removed after the annealing process. The ability to constrain and/or passivate free charge in and/or near the passivation layer may be enhanced by performing the annealing process with the auxiliary layer covering the passivation layer. The electrical performance of the image sensing device may be improved accordingly.
    Type: Grant
    Filed: September 15, 2019
    Date of Patent: August 31, 2021
    Assignee: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng Sun, Xilong Wang, Sheng Hu
  • Patent number: 10840085
    Abstract: The invention discloses a method for improving bonding of dangling bonds of silicon atoms. A surface of a wafer is oxidized to form a silicon oxide layer. The upper surface of the silicon oxide layer has a dangling bond. A dielectric layer is disposed on the upper surface of the silicon oxide layer, which is then subjected to an oxygen-enriched oxidation treatment at a preset first temperature. A protective layer is disposed on the upper surface of the dielectric layer. The wafer is then subjected to an annealing treatment. By passing oxidizing gas through the surface of the protective layer, oxygen ions in the oxidizing gas penetrate the dielectric layer to reach wafer surface. After high-temperature annealing treatment, the unsaturated bonds of the silicon atoms are bonded to the oxygen ions on the wafer surface, thereby improving the bonding of the dangling bonds on the wafer surface.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: November 17, 2020
    Assignee: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
    Inventors: Xilong Wang, Sheng Hu, Wen Zou
  • Publication number: 20200013824
    Abstract: A manufacturing method of an image sensing device includes the following steps. A substrate is provided. At least one image sensing unit is disposed in the substrate. A passivation layer is formed on the substrate. An auxiliary layer is formed on the passivation layer. A material composition of the auxiliary layer is different from a material composition of the passivation layer. An annealing process is performed to the substrate and the passivation layer. The passivation layer is covered by the auxiliary layer during the annealing process. The auxiliary layer is removed after the annealing process. The ability to constrain and/or passivate free charge in and/or near the passivation layer may be enhanced by performing the annealing process with the auxiliary layer covering the passivation layer. The electrical performance of the image sensing device may be improved accordingly.
    Type: Application
    Filed: September 15, 2019
    Publication date: January 9, 2020
    Inventors: PENG SUN, XILONG WANG, SHENG HU
  • Publication number: 20190333762
    Abstract: The invention discloses a method for improving bonding of dangling bonds of silicon atoms. A surface of a wafer is oxidized to form a silicon oxide layer. The upper surface of the silicon oxide layer has a dangling bond. A dielectric layer is disposed on the upper surface of the silicon oxide layer, which is then subjected to an oxygen-enriched oxidation treatment at a preset first temperature. A protective layer is disposed on the upper surface of the dielectric layer. The wafer is then subjected to an annealing treatment. By passing oxidizing gas through the surface of the protective layer, oxygen ions in the oxidizing gas penetrate the dielectric layer to reach wafer surface. After high-temperature annealing treatment, the unsaturated bonds of the silicon atoms are bonded to the oxygen ions on the wafer surface, thereby improving the bonding of the dangling bonds on the wafer surface.
    Type: Application
    Filed: March 12, 2019
    Publication date: October 31, 2019
    Inventors: XILONG WANG, SHENG HU, WEN ZOU
  • Patent number: 7753075
    Abstract: The Invention relates to an upwardly and downwardly discharged faucet for comfortable use, comprising a main handle and a main valve body. The main valve body is provided with a diverting valve with dual ports. The diverting valve comprises a valve seat mounted on the main valve body. On the bottom side wall of the valve seat are disposed a left inlet and right inlet which are in communication with a main conduit, respectively. Within a chamber is disposed a diverting valve core, in which an upper water conduit and a lower water conduit are disposed. The upper water conduit is in adjustable communication with the right inlet; and the lower water conduit is in adjustable communication with the left inlet. The outlet of the lower water conduit is in communication with the bottom of the chamber. On the upper end of the diverting valve core is provided a rotary valve stem.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: July 13, 2010
    Inventors: Bigui Lin, Xilong Wang
  • Publication number: 20080142101
    Abstract: The Invention relates to an upwardly and downwardly discharged faucet for comfortable use, comprising a main handle and a main valve body. The main valve body is provided with a diverting valve with dual ports. The diverting valve comprises a valve seat mounted on the main valve body. On the bottom side wall of the valve seat are disposed a left inlet and right inlet which are in communication with a main conduit, respectively. Within a chamber is disposed a diverting valve core, in which an upper water conduit and a lower water conduit are disposed. The upper water conduit is in adjustable communication with the right inlet; and the lower water conduit is in adjustable communication with the left inlet. The outlet of the lower water conduit is in communication with the bottom of the chamber. On the upper end of the diverting valve core is provided a rotary valve stem.
    Type: Application
    Filed: June 23, 2005
    Publication date: June 19, 2008
    Inventors: Bigui Lin, Xilong Wang
  • Patent number: D905511
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: December 22, 2020
    Assignee: SHENZHEN ZHIYUAN TECH CO., LTD.
    Inventor: Xilong Wang
  • Patent number: D958572
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: July 26, 2022
    Assignee: SHENZHEN ZHIYUAN TECH CO., LTD
    Inventor: Xilong Wang