Patents by Inventor Ximan Jiang
Ximan Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11830705Abstract: A method for altering surface charge on an insulating surface of a first sample includes generating first plasma inside a plasma source, causing the first plasma to diffuse into a first vacuum chamber to generate second downstream plasma, immersing the first sample in the second downstream plasma, and applying a first bias voltage to a conductive layer of the first sample, or applying a first bias voltage to a metal holder that holds the first sample.Type: GrantFiled: April 5, 2021Date of Patent: November 28, 2023Inventor: Ximan Jiang
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Patent number: 11735398Abstract: A method for altering surface charge on an insulating surface of a first sample includes generating first plasma inside a plasma source, causing the first plasma to diffuse into a first vacuum chamber to generate second downstream plasma, immersing the first sample in the second downstream plasma, and applying a first bias voltage to a conductive layer of the first sample, or applying a first bias voltage to a metal holder that holds the first sample.Type: GrantFiled: April 5, 2021Date of Patent: August 22, 2023Inventor: Ximan Jiang
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Publication number: 20220059326Abstract: A method for altering surface charge on an insulating surface of a first sample includes generating first plasma inside a plasma source, causing the first plasma to diffuse into a first vacuum chamber to generate second downstream plasma, immersing the first sample in the second downstream plasma, and applying a first bias voltage to a conductive layer of the first sample, or applying a first bias voltage to a metal holder that holds the first sample.Type: ApplicationFiled: April 5, 2021Publication date: February 24, 2022Applicant: PIE Scientific LLCInventor: Ximan Jiang
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Patent number: 10241217Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.Type: GrantFiled: October 26, 2017Date of Patent: March 26, 2019Assignee: KLA-Tencor CorporationInventors: Ximan Jiang, Anatoly Romanovsky, Christian Wolters, Stephen Biellak, Mous Tatarkhanov
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Patent number: 9997335Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.Type: GrantFiled: May 16, 2017Date of Patent: June 12, 2018Inventor: Ximan Jiang
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Publication number: 20180045837Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.Type: ApplicationFiled: October 26, 2017Publication date: February 15, 2018Inventors: Ximan Jiang, Anatoly Romanovsky, Christian Wolters, Stephen Biellak, Mous Tatarkhanov
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Patent number: 9841512Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.Type: GrantFiled: November 19, 2015Date of Patent: December 12, 2017Assignee: KLA-Tencor CorporationInventors: Ximan Jiang, Anatoly Romanovsky, Christian Wolters, Stephen Biellak, Mous Tatarkhanov
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Publication number: 20170294290Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.Type: ApplicationFiled: May 16, 2017Publication date: October 12, 2017Inventor: Ximan Jiang
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Patent number: 9691592Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.Type: GrantFiled: April 7, 2016Date of Patent: June 27, 2017Inventor: Ximan Jiang
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Patent number: 9666419Abstract: The disclosure is directed to image intensifier tube designs for field curvature aberration correction and ion damage reduction. In some embodiments, electrodes defining an acceleration path from a photocathode to a scintillating screen are configured to provide higher acceleration for off-axis electrons along at least a portion of the acceleration path. Off-axis electrons and on-axis electrons are accordingly focused on the scintillating screen with substantial uniformity to prevent or reduce field curvature aberration. In some embodiments, the electrodes are configured to generate a repulsive electric field near the scintillating screen to prevent secondary electrons emitted or deflected by the scintillating screen from flowing towards the photocathode and forming damaging ions.Type: GrantFiled: August 2, 2013Date of Patent: May 30, 2017Assignee: KLA-Tencor CorporationInventors: Ximan Jiang, Qing Li, Stephen Biellak
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Publication number: 20160334516Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.Type: ApplicationFiled: November 19, 2015Publication date: November 17, 2016Inventors: Ximan Jiang, Anatoly Romanovsky, Christian Wolters, Stephen Biellak
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Publication number: 20160300696Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.Type: ApplicationFiled: April 7, 2016Publication date: October 13, 2016Inventor: Ximan Jiang
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Patent number: 9460886Abstract: An electron-bombarded detector for detecting low light signals includes a vacuum tube structure defining a cylindrical vacuum tube chamber, a photocathode disposed at a first end of the vacuum tube chamber, a sensor disposed at a second end of the vacuum tube chamber, ring electrodes disposed in the vacuum tube chamber for generating an electric field that accelerates emitted photoelectrons toward the sensor, and a magnetic field generator configured to generate a symmetric magnetic field that applies a focusing lens effect on the photoelectrons. The ring electrodes and magnetic field generator are operating using one of a reduced distance focusing approach and an acceleration/deceleration approach such that the photoelectrons have a landing energy below 2 keV. The use of reflective mode photocathodes is enabled using either multi-pole deflector coils, or ring electrodes formed by segmented circular electrode structures. Large angle deflections are achieved using magnetic or electrostatic deflectors.Type: GrantFiled: February 4, 2015Date of Patent: October 4, 2016Assignee: KLA-Tencor CorporationInventors: Ximan Jiang, Stephen Biellak, John Fielden
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Publication number: 20160027605Abstract: An electron-bombarded detector for detecting low light signals includes a vacuum tube structure defining a cylindrical vacuum tube chamber, a photocathode disposed at a first end of the vacuum tube chamber, a sensor disposed at a second end of the vacuum tube chamber, ring electrodes disposed in the vacuum tube chamber for generating an electric field that accelerates emitted photoelectrons toward the sensor, and a magnetic field generator configured to generate a symmetric magnetic field that applies a focusing lens effect on the photoelectrons. The ring electrodes and magnetic field generator are operating using one of a reduced distance focusing approach and an acceleration/deceleration approach such that the photoelectrons have a landing energy below 2 keV. The use of reflective mode photocathodes is enabled using either multi-pole deflector coils, or ring electrodes formed by segmented circular electrode structures. Large angle deflections are achieved using magnetic or electrostatic deflectors.Type: ApplicationFiled: February 4, 2015Publication date: January 28, 2016Inventors: Ximan Jiang, Stephen Biellak, John Fielden
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Patent number: 9116109Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: March 31, 2014Date of Patent: August 25, 2015Assignee: KLA-Tencor CorporationInventors: Hong Xiao, Ximan Jiang
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Publication number: 20140319340Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: March 31, 2014Publication date: October 30, 2014Applicant: KLA-Tencor CorporationInventors: Hong XIAO, Ximan JIANG
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Patent number: 8723115Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: March 27, 2012Date of Patent: May 13, 2014Assignee: KLA-Tencor CorporationInventors: Hong Xiao, Ximan Jiang
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Publication number: 20140063502Abstract: The disclosure is directed to image intensifier tube designs for field curvature aberration correction and ion damage reduction. In some embodiments, electrodes defining an acceleration path from a photocathode to a scintillating screen are configured to provide higher acceleration for off-axis electrons along at least a portion of the acceleration path. Off-axis electrons and on-axis electrons are accordingly focused on the scintillating screen with substantial uniformity to prevent or reduce field curvature aberration. In some embodiments, the electrodes are configured to generate a repulsive electric field near the scintillating screen to prevent secondary electrons emitted or deflected by the scintillating screen from flowing towards the photocathode and forming damaging ions.Type: ApplicationFiled: August 2, 2013Publication date: March 6, 2014Applicant: KLA-Tencor CorporationInventors: Ximan Jiang, Qing Li, Stephen Biellak
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Publication number: 20130256528Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: March 27, 2012Publication date: October 3, 2013Inventors: Hong XIAO, Ximan JIANG
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Patent number: 7609815Abstract: Techniques for controllably directing beamlets to a target substrate are disclosed. The beamlets may be either positive ions or electrons. It has been shown that beamlets may be produced with a diameter of 1 ?m, with inter-aperture spacings of 12 ?m. An array of such beamlets, may be used for maskless lithography. By step-wise movement of the beamlets relative to the target substrate, individual devices may be directly e-beam written. Ion beams may be directly written as well. Due to the high brightness of the beamlets from extraction from a multicusp source, exposure times for lithographic exposure are thought to be minimized. Alternatively, the beamlets may be electrons striking a high Z material for X-ray production, thereafter collimated to provide patterned X-ray exposures such as those used in CAT scans. Such a device may be used for remote detection of explosives.Type: GrantFiled: June 1, 2007Date of Patent: October 27, 2009Assignee: The Regents of the University of CaliforniaInventors: Ka-Ngo Leung, Qing Ji, William A. Barletta, Ximan Jiang, Lili Ji