Patents by Inventor Ximeng Yang

Ximeng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate interconnect routing
    Patent number: 8427819
    Abstract: One or more data signal interconnects arranged on a substrate of a dense array reduce overall size of a device incorporating the dense array, such as a touch sensor or display. The data signal interconnects on the substrate carry signals from printed circuits coupled to the array to a controller via interconnect tabs.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: April 23, 2013
    Assignee: Amazon Technologies, Inc.
    Inventors: Chris T. Li, Christopher Paul Lander, Ximeng Yang, Amish Rajesh Babu, Shyeu-Yang Wang