Patents by Inventor Xin F. Zheng

Xin F. Zheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Parallel seam welding leadless ceramic package
    Patent number: 10410960
    Abstract: The application discloses a parallel seam welding leadless ceramic package, including a ceramic, a sealing ring and a metal cover plate; a back surface of the ceramic is provided with a back grounding metal pattern, and the back grounding metal pattern is provided with several outwardly protruding grounding terminals, a RF signal transmission pad is disposed between every two adjacent grounding terminals, the front grounding metal pattern and the back grounding metal pattern are interconnected by the internal and/or external metallized interconnection holes, the front grounding line and the back grounding metal pattern is interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines are interconnected to the RF signal transmission pad by a separated external and/or external metallized interconnection hole.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: September 10, 2019
    Assignee: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
    Inventors: Zhizhuang Qiao, Linjie Liu, Xin F. Zheng
  • PARALLEL SEAM WELDING LEADLESS CERAMIC PACKAGE
    Publication number: 20190259692
    Abstract: The application discloses a parallel seam welding leadless ceramic package, including a ceramic, a sealing ring and a metal cover plate; a back surface of the ceramic is provided with a back grounding metal pattern, and the back grounding metal pattern is provided with several outwardly protruding grounding terminals, a RF signal transmission pad is disposed between every two adjacent grounding terminals, the front grounding metal pattern and the back grounding metal pattern are interconnected by the internal and/or external metallized interconnection holes, the front grounding line and the back grounding metal pattern is interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines are interconnected to the RF signal transmission pad by a separated external and/or external metallized interconnection hole.
    Type: Application
    Filed: August 28, 2017
    Publication date: August 22, 2019
    Inventors: Zhizhuang QIAO, Linjie LIU, Xin F. ZHENG