Abstract: A camera device connection structure includes a circuit board, a lens assembly and a case assembly. The lens assembly is disposed on upper side of the circuit board and has a first mating section and a second mating section respectively disposed on two opposite sides of the lens assembly. The case assembly has a first case body and a second case body. The first and second case bodies are disposed on the upper side of the circuit board and respectively positioned on two sides of the lens assembly. The first and second case bodies respectively have a first connection section and a second connection section corresponding to the lens assembly. The first and second connection sections are respectively connected with the first and second mating sections of the lens assembly, whereby the structural strength of the camera device can be still enhanced in precondition that the camera device is thinned.

Abstract: A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

Abstract: A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.

Abstract: A face identification module includes a substrate. The substrate has a first plane face. On the first place face are disposed a first lens assembly, a second lens assembly, an infrared LED assembly and an image processor, which are respectively electrically connected with the substrate. The infrared LED assembly includes a first infrared LED and a second infrared LED. The first infrared LED and the second infrared LED are adjacently disposed on left and right sides of the second lens assembly. In the face identification module, the video function and the face identification function are integrated to save arrangement space and achieve a multiplex face identification module.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: A camera module protection structure includes a circuit board, a case and a camera device. The case is disposed on the circuit board. At least one side of the case is formed with a securing section. The case is formed with a receiving space in a position corresponding to the securing section. The camera device is correspondingly disposed in the receiving space. According to the structural design of the camera module protection structure, the securing section of the case is able to enhance the structural strength of the entire camera module and greatly lower the damage ratio of the camera module and prevent the circuit board from being easily broken off or damaged in assembling process of the camera module.

Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.