Abstract: The present invention discloses a package of the LED chip and the related manufacturing method. The present invention is related to the LED package process. The package includes a transparent substrate, the LED chips, conductive wires and so on. The LED chips are installed reversely on the transparent substrate in order to improve the luminous efficiency and to simplify the process procedures.

Abstract: The present invention includes a LED light bulb and the manufacturing method thereof. The manufacturing method includes the following steps. In the step A, produce a LED light source. In the step B, fasten the LED light source. The LED light bulb of the present invention is related to the LED lightening lamp and includes a LED light source, a frame, a lampshade, a lamp holder and a power supply. The LED light source is installed on the frame and sheltered via the lampshade. The LED light source and the power supply are electrically coupled together via a lead. The power supply is installed inside the lamp stand. Consequently, the cost may be reduced and the processes of the LED light bulb may be simplified as well.

Abstract: The present invention is related to a LED light source and its manufacturing method. It is related to the LED technology field. The LED light source includes a glass case, LED chips sealed inside the glass case and the transparent substrate carrying the LED chips. The manufacturing method of the present invention is simple and easy.