Patents by Inventor Xing-Fu Zhong
Xing-Fu Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220041810Abstract: A high-temperature-stable spin-on-carbon (“SOC”) material that fills topography features on a substrate while planarizing the surface in a one-step, thin layer coating process is provided. The material comprises low molecular weight polyimides or diimides that are pre-imidized in solution rather than on the wafer. The SOC layers can survive harsh CVD conditions and are also SC1 resistant, especially on TiN and SiOx surfaces.Type: ApplicationFiled: August 6, 2021Publication date: February 10, 2022Inventors: Xing-Fu Zhong, Runhui Huang, Gu Xu, Sean Simmons, Daniel Sweat, Jakub Koza
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Patent number: 10854451Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.Type: GrantFiled: June 21, 2016Date of Patent: December 1, 2020Assignee: Brewer Science, Inc.Inventors: Xing-Fu Zhong, Runhui Huang, Boyu Zhang
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Patent number: 9827740Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.Type: GrantFiled: July 22, 2015Date of Patent: November 28, 2017Assignee: Brewer Science Inc.Inventors: Xiao Liu, Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu
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Publication number: 20160372326Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.Type: ApplicationFiled: June 21, 2016Publication date: December 22, 2016Inventors: Xing-Fu Zhong, Runhui Huang, Boyu Zhang
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Patent number: 9472436Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: May 8, 2014Date of Patent: October 18, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9263314Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: August 4, 2011Date of Patent: February 16, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20160023436Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.Type: ApplicationFiled: July 22, 2015Publication date: January 28, 2016Inventors: Xiao Liu, Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu
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Patent number: 9224631Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: February 27, 2014Date of Patent: December 29, 2015Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9117757Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions.Type: GrantFiled: October 16, 2013Date of Patent: August 25, 2015Assignee: Brewer Science Inc.Inventors: Jyoti K. Malhotra, Xing-Fu Zhong
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Publication number: 20150122426Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: November 21, 2014Publication date: May 7, 2015Applicant: BREWER SCIENCE INC.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 8940104Abstract: A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.Type: GrantFiled: August 2, 2011Date of Patent: January 27, 2015Assignee: Brewer Science Inc.Inventors: Xing-Fu Zhong, John Moore
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Publication number: 20140239453Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: May 8, 2014Publication date: August 28, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 8771927Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.Type: GrantFiled: March 5, 2010Date of Patent: July 8, 2014Assignee: Brewer Science Inc.Inventors: Tingji Tang, Gu Xu, Xing-Fu Zhong, Wenbin Hong, Tony D. Flaim, Kimberly Yess, Ramachandran K. Trichur
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Publication number: 20140174627Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20140162034Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: August 4, 2011Publication date: June 12, 2014Applicant: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20140103546Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions.Type: ApplicationFiled: October 16, 2013Publication date: April 17, 2014Applicant: Brewer Science Inc.Inventors: Jyoti K. Malhotra, Xing-Fu Zhong
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Publication number: 20130032296Abstract: A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.Type: ApplicationFiled: August 2, 2011Publication date: February 7, 2013Applicant: BREWER SCIENCE INC.Inventor: Xing-Fu Zhong
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Publication number: 20120034437Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: August 4, 2011Publication date: February 9, 2012Applicant: BREWER SCIENCE INC.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20110171478Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.Type: ApplicationFiled: March 5, 2010Publication date: July 14, 2011Applicant: BREWER SCIENCE INC.Inventors: Tingji Tang, Gu Xu, Xing-Fu Zhong, Wenbin Hong, Tony D. Flaim, Kimberly Yess, Ramachandran K. Trichur
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Patent number: 7709178Abstract: New photoresists for use during the production of semiconductor and MEMS devices are provided. The primer layer preferably comprises a silane dissolved or dispersed in a solvent system. The photoresist layer includes a first polymer prepared from a styrene and an acrylonitrile, and a second polymer comprising epoxy-containing monomers (and preferably phenolic-containing monomers). The photoresist layer comprises a photoacid generator, and is preferably negative-acting.Type: GrantFiled: April 17, 2007Date of Patent: May 4, 2010Assignee: Brewer Science Inc.Inventors: Xing-Fu Zhong, Tony D. Flaim, Jyoti Malhotra