Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

Abstract: A method of preparing a ribofuranose derivative essentially free of pyranose compounds includes a step of contacting a solution of MDR containing MDRP as an impurity in a solvent including methanol and/or tetrahydrofuran with at least one alkali metal periodate under conditions sufficient to oxidize at least a portion of the MDRP. MDR containing at most 5 wt % of MDRP based on the total weight of MDR and MDRP may be produced.

Abstract: One embodiment of a power supply input routing apparatus can include a multilayer printed circuit board configured to accept only an alternating current (AC) line voltage, return and ground signals. The AC power jumper board can advantageously route AC power from one section of the power supply to another without burdening the power supply design with extra layer requirements or negatively increasing power supply area. Embodiments including an electronic device having a power supply as above are also disclosed.

Abstract: The present invention discloses a method and an apparatus for data interaction, and the method includes: obtaining required times of data interaction between valid applications in a background application mode and a network; selecting a minimum required time from the current required times as a target required time of data interaction, and starting timing; when the target required time expires, obtaining each valid application whose current required time of data interaction is between two consecutive target required times, and determining the valid application as a target application; and activating a packet data protocol PDP, establishing a data link between the target application and the network, and performing data interaction, and then restarting timing.

Abstract: A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

Abstract: A method of preparing a ribofuranose derivative essentially free of pyranose compounds includes a step of contacting a solution of MDR containing MDRP as an impurity in a solvent including methanol and/or tetrahydrofuran with at least one alkali metal periodate under conditions sufficient to oxidize at least a portion of the MDRP. MDR containing at most 5 wt % of MDRP based on the total weight of MDR and MDRP may be produced.

Abstract: A housing includes a plastic substrate, a supporting layer, a hair line layer, a decorative layer, and a transparent protection layer. The supporting layer, the hair line layer, the decorative layer, and the transparent protection layer are formed on the substrate in that order.

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

Abstract: A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

Abstract: A housing for an electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The color coating layer defines a pattern embedded in the color coating layer. The decorative layer is coated on the color coating layer and the pattern. The decorative layer has light reflective capability, and a thickness of the decorative layer is less than a depth of the pattern.

Abstract: A housing includes a plastic substrate, a supporting layer, a hair line layer, a decorative layer, and a transparent protection layer. The supporting layer, the hair line layer, the decorative layer, and the transparent protection layer are formed on the substrate in that order.

Abstract: New photoresists for use during the production of semiconductor and MEMS devices are provided. The primer layer preferably comprises a silane dissolved or dispersed in a solvent system. The photoresist layer includes a first polymer prepared from a styrene and an acrylonitrile, and a second polymer comprising epoxy-containing monomers (and preferably phenolic-containing monomers). The photoresist layer comprises a photoacid generator, and is preferably negative-acting.

Abstract: New photoresists for use during the production of semiconductor and MEMS devices are provided. The primer layer preferably comprises a silane dissolved or dispersed in a solvent system. The photoresist layer includes copolymers prepared from styrene, acrylonitrile, and epoxy-containing monomers. The photoresist layer comprises a photoacid generator, and is preferably negative-acting.

Abstract: There is provided a composition that can effectively remove a protective coating and a primer coating that have a resistance to etching solutions and are rendered unnecessary after wet-etching treatment in MEMS fabrication processes, and a method for removing the protective layer. The composition contains (A) at least one organic solvent selected from the group consisting of amides, lactones, pyrrolidones and ketones, (B) water, and (C) a fluoride, in an amount of 80.00 to 99.90 mass %, 0.05 to 12.00 mass %, and 0.05 to 8.00 mass %, respectively. The composition may further contain (D) phosphoric acid, phosphonic acid or phosphinic acid in an amount over 0 mass part to 5.5 mass parts, or (E) an organic amine in an amount over 0 mass part to 45 mass parts, based on 100 mass parts of the composition.

Abstract: There is provided a composition that can effectively remove a protective coating and a primer coating that have a resistance to etching solutions and are rendered unnecessary after wet-etching treatment in MEMS fabrication processes, and a method for removing the protective layer. The composition contains (A) at least one organic solvent selected from the group consisting of amides, lactones, pyrrolidones and ketones, (B) water, and (C) a fluoride, in an amount of 80.00 to 99.90 mass %, 0.05 to 12.00 mass %, and 0.05 to 8.00 mass %, respectively. The composition may further contain (D) phosphoric acid, phosphonic acid or phosphinic acid in an amount over 0 mass part to 5.5 mass parts, or (E) an organic amine in an amount over 0 mass part to 45 mass parts, based on 100 mass parts of the composition.

Abstract: Photocurable, conductive, and transparent polymer coating compositions and methods of using the same are provided. The compositions include a photopolymer and an electrically conductive polymer dissolved or dispersed in a solvent system. Preferred photopolymers include water-miscible, multifunctional acrylates. Preferred electrically conductive polymers include poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT-PSS). The compositions preferably also contain a photoinitiator and may contain a water-immiscible acrylate and/or a surfactant. The compositions are applied to substrates and exposed to actinic radiation such as ultraviolet (UV) light to form a cured, durable, conductive, and transparent coating.