Patents by Inventor Xing Ge

Xing Ge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9589489
    Abstract: The present invention discloses a probe frame for an array substrate detecting apparatus, the probe frame including a frame body and a signal distribution circuit board provided to the frame body, wherein the probe frame further includes: a circuit board provided to the frame body, the circuit board being provided with through holes, and the circuit board being provided therein with a plurality of signal transmission wires in a one to one correspondence with the through holes, one end of each signal transmission wire is inserted into its respective through hole and the other end thereof is electrically connected with an output end of the signal distribution circuit board; and a plurality of probes in a one to one correspondence with the through holes, wherein for each pair of the probe and the through hole, one end of the probe is inserted into the through hole so as to be electrically connected with the signal transmission wire within the through hole.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 7, 2017
    Assignees: BOE Technology Group Co., Ltd., Beijing BOE Display Technology Co., Ltd.
    Inventors: Xing Ge, Zhen Wei, Chengda Zhu, Jian Sheng, Yuanyi Cai, Lixing Zhang, Qingsheng Li
  • Publication number: 20140167807
    Abstract: The present invention discloses a probe frame for an array substrate detecting apparatus, the probe frame including a frame body and a signal distribution circuit board provided to the frame body, wherein the probe frame further includes: a circuit board provided to the frame body, the circuit board being provided with through holes, and the circuit board being provided therein with a plurality of signal transmission wires in a one to one correspondence with the through holes, one end of each signal transmission wire is inserted into its respective through hole and the other end thereof is electrically connected with an output end of the signal distribution circuit board; and a plurality of probes in a one to one correspondence with the through holes, wherein for each pair of the probe and the through hole, one end of the probe is inserted into the through hole so as to be electrically connected with the signal transmission wire within the through hole.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicants: Beijing BOE Display Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xing Ge, Zhen Wei, Chengda Zhu, Jian Sheng, Yuanyi Cai, Lixing Zhang, Qingsheng Li