Patents by Inventor Xing Lan

Xing Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260082489
    Abstract: A printed circuit board (PCB) that has been fabricated by a 3D printing process. The PCB includes a substrate printed by the 3D printing process, a plurality of stacked dielectric layers printed on the substrate by the 3D printing process, and a plurality of embedded electrical circuit components printed by the 3D printing process on and throughout the substrate and the plurality of dielectric layers. The PCB can be part of a device that operates at millimeter wave frequencies, such as a mm-wave antenna.
    Type: Application
    Filed: September 17, 2024
    Publication date: March 19, 2026
    Inventors: Xing Lan, Arturo J. Mateos, Jesse B. Tice, Rajinder R. Sandhu
  • Patent number: 10312580
    Abstract: A tunable antenna structure including a substrate and at least one radiating element configured on the substrate. The antenna structure further includes a plurality of nanomaterial-based phase changing material (PCM) switches configured in the radiating element so that current flowing through the radiating element passes through the PCM switches. The antenna structure also includes a heating device, such as a laser or a resistive heater, configured relative to the PCM switches and being operable to selectively heat the PCM switches to switch the PCM switches between an on crystalline state and an off amorphous state, where once the heat is removed, the PCM switch remains in the particular state.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: June 4, 2019
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Xing Lan, Vesna Radisic, Robert Miles Young, Nabil A. El-Hinnawy
  • Patent number: 10091888
    Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: October 2, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Xing Lan, Daniel R. Scherrer, Jesse B. Tice, Patrick J. Case, Xianglin Zeng
  • Publication number: 20170271114
    Abstract: A method for fabricating an MEMS switch including providing a substrate and printing at least one metal bias electrode, at least one metal connection pad and at least one metal contact pad on the substrate. The method then prints a sacrificial layer on the substrate and over the at least one bias electrode, and prints a flexible beam structure on the sacrificial layer. The sacrificial layer is then removed by dissolving the sacrificial layer in a wet solution to release the beam structure so that the beam structure is spaced some distance from the at least one bias electrode and the contact pad.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 21, 2017
    Inventors: XING LAN, Chunbo Zhang
  • Publication number: 20170223838
    Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 3, 2017
    Inventors: Xing Lan, Daniel R. Scherrer, Jesse B. Tice, Patrick J. Case, Xianglin Zeng
  • Patent number: 9425840
    Abstract: A system and method for wideband tunable notch cancellation that is passive and does not require feedback or feed forward circuitry. An input spectrum containing interference is split into two signals that are 180 degrees out of phase with each other. The preferred signal is filtered out of the 180 degree out of phase signal using a notch filter while the original signal is sent through a delay line. Then the two signals are summed with a power summer so that the interference signals that are 180 degrees out of phase with those in the original signal are cancelled out and the preferred signal remains. The notch filter is tunable to different preferred signals.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: August 23, 2016
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Mark Kintis, Xing Lan
  • Publication number: 20140323076
    Abstract: A system and method for wideband tunable notch cancellation that is passive and does not require feedback or feed forward circuitry. An input spectrum containing interference is split into two signals that are 180 degrees out of phase with each other. The preferred signal is filtered out of the 180 degree out of phase signal using a notch filter while the original signal is sent through a delay line. Then the two signals are summed with a power summer so that the interference signals that are 180 degrees out of phase with those in the original signal are cancelled out and the preferred signal remains. The notch filter is tunable to different preferred signals.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 30, 2014
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Mark Kintis, Xing Lan
  • Patent number: 8610515
    Abstract: A time delay circuit including at least one spiral delay line formed on a top surface of a first substrate. In one embodiment, the delay line is defined by two concentric spiral delay line sections. Vias extend through the substrate between the delay line sections to reduce cross-talk therebetween. In another embodiment, the delay circuit includes a second substrate spaced from the first substrate, where a spiral delay line is formed on a top surface of the second substrate. A planar metal layer is provided on a backside surface of the first substrate and a conductive element extends through an opening in the metal layer and is coupled to the spiral delay lines, where the planar member provides magnetic isolation between the delay lines. In yet another embodiment, a multi-bit switched circuit can be provided on one of the substrates and be electrically connected to the delay line.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: December 17, 2013
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Xing Lan, Mark Kintis, Chad Hansen
  • Publication number: 20120286899
    Abstract: A time delay circuit including at least one spiral delay line formed on a top surface of a first substrate. In one embodiment, the delay line is defined by two concentric spiral delay line sections. Vias extend through the substrate between the delay line sections to reduce cross-talk therebetween. In another embodiment, the delay circuit includes a second substrate spaced from the first substrate, where a spiral delay line is formed on a top surface of the second substrate. A planar metal layer is provided on a backside surface of the first substrate and a conductive element extends through an opening in the metal layer and is coupled to the spiral delay lines, where the planar member provides magnetic isolation between the delay lines. In yet another embodiment, a multi-bit switched circuit can be provided on one of the substrates and be electrically connected to the delay line.
    Type: Application
    Filed: May 9, 2011
    Publication date: November 15, 2012
    Applicant: Northrop Grumman Systems Corporation
    Inventors: Xing Lan, Mark Kintis, Chad Hansen
  • Patent number: 7733194
    Abstract: A modulator is provided that comprises a nonlinear transmission line (NLTL) that is bias modulated by a baseband signal. A given logic state of the baseband signal determines a delay amount of a first carrier signal through the NLTL. The modulator further comprises an impulse forming network (IFN) that includes a first NLTL that receives the first carrier signal delayed by the determined delay amount and a second NLTL that receives a second carrier signal having a fixed delay amount. The first NLTL and second NLTL within the IFN have opposite diode polarity configurations. The modulator further comprises a power combiner that converts a delta delay of the first carrier signal relative to the second carrier signal to a sharp impulse that represents the given logic state of the baseband signal.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: June 8, 2010
    Assignee: Northrop Grumman Space and Mission Systems Corporation
    Inventors: Xing Lan, Mark Kintis, Flavia S. Fong
  • Patent number: 7570137
    Abstract: A ferroelectric loaded waveguide resonator capable of operation at microwave, millimeter-wave and higher frequencies and suitable for integration into a three-dimensional monolithic microwave integrated circuit (3D MMIC) is disclosed. The resonator includes a resonator cavity, which, in one form of the invention, is formed by two parallel metal layers and a metallized wall structure extending between the metal layers. The cavity is filled with dielectric material and includes a layer of ferroelectric material, which is used to control the resonant frequency by varying a voltage bias applied to the ferroelectric layer. The cavity includes a slot in one of the metal layers and a coupling strip formed adjacent to the slot to provide electromagnetic coupling to other components, such as a voltage controlled oscillator (VCO). The invention can also be applied to other multi-metal semiconductor or wafer level packaging technologies.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: August 4, 2009
    Assignee: Northrop Grumman Corporation
    Inventors: Mark Kintis, Flavia S. Fong, Thomas T. Y. Wong, Xing Lan
  • Patent number: 7570129
    Abstract: A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: August 4, 2009
    Assignee: Northrop Grumman Corporation
    Inventors: Mark Kintis, Flavia S. Fong, Xing Lan
  • Publication number: 20090115545
    Abstract: A modulator is provided that comprises a nonlinear transmission line (NLTL) that is bias modulated by a baseband signal. A given logic state of the baseband signal determines a delay amount of a first carrier signal through the NLTL. The modulator further comprises an impulse forming network (IFN) that includes a first NLTL that receives the first carrier signal delayed by the determined delay amount and a second NLTL that receives a second carrier signal having a fixed delay amount. The first NLTL and second NLTL within the IFN have opposite diode polarity configurations. The modulator further comprises a power combiner that converts a delta delay of the first carrier signal relative to the second carrier signal to a sharp impulse that represents the given logic state of the baseband signal.
    Type: Application
    Filed: November 2, 2007
    Publication date: May 7, 2009
    Inventors: Xing Lan, Mark Kintis, Flavia S. Fong
  • Patent number: 7462956
    Abstract: A device and method are disclosed for synthesizing a waveform having pulse segments. An exemplary generator can include units having a time delay element and pulse generator generating the pulse segments. An input divider divides an input signal into signal instances that propagate through the units and an output combiner combines pulse segments to form the waveform. The pulse generators include a sharpening circuit for sharpening a rising edge and a falling edge of the pulse segments. The sharpening circuit includes a tunable delay element coupled to a non-linear transmission line (NLTL). Another NLTL can be coupled in parallel with the tunable delay element and the first NLTL. The NLTLs include input sections coupled to anodes or cathodes of Schottky diode elements, and the respective cathodes or anodes are coupled to a signal ground.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: December 9, 2008
    Assignee: Northrop Grumman Space & Mission Systems Corp.
    Inventors: Xing Lan, Mark Kintis, Flavia S. Fong
  • Publication number: 20080169846
    Abstract: A device and method are disclosed for synthesizing a waveform having pulse segments. An exemplary generator can include units having a time delay element and pulse generator generating the pulse segments. An input divider divides an input signal into signal instances that propagate through the units and an output combiner combines pulse segments to form the waveform. The pulse generators include a sharpening circuit for sharpening a rising edge and a falling edge of the pulse segments. The sharpening circuit includes a tunable delay element coupled to a non-linear transmission line (NLTL). Another NLTL can be coupled in parallel with the tunable delay element and the first NLTL. The NLTLs include input sections coupled to anodes or cathodes of Schottky diode elements, and the respective cathodes or anodes are coupled to a signal ground.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 17, 2008
    Applicant: Northrop Grumman Corporation
    Inventors: Xing Lan, Mark Kintis, Flavia S. Fong
  • Patent number: 7276981
    Abstract: A three dimensional (3D) microwave monolithic integrated circuit (MMIC) multi-push voltage controlled oscillator (VCO) and methods of making the same is provided. The 3D MMIC multi-push oscillator includes a plurality of matching frequency oscillators coupled to a phasing ring in substantially equidistantly spaced apart locations. A combined VCO output signal is provided at a central output connection point of the phasing ring. The central output connection point resides on a first plane. An output conductor transition has a first end coupled to the central output connection point and a second end provided as an output to the quad-push VCO. The output conductor transition extends transverse to the first plane and terminates at a second plane separated from the first plane. The multi-push oscillator can be a push-push, quad-push or N-push type VCO based on a particular implementation.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: October 2, 2007
    Assignee: Northrop Grumman Corporation
    Inventors: Mark Kintis, Flavia S. Fong, Thomas T. Y. Wong, Xing Lan
  • Publication number: 20070109078
    Abstract: A ferroelectric loaded waveguide resonator capable of operation at microwave, millimeter-wave and higher frequencies and suitable for integration into a three-dimensional monolithic microwave integrated circuit (3D MMIC) is disclosed. The resonator includes a resonator cavity, which, in one form of the invention, is formed by two parallel metal layers and a metallized wall structure extending between the metal layers. The cavity is filled with dielectric material and includes a layer of ferroelectric material, which is used to control the resonant frequency by varying a voltage bias applied to the ferroelectric layer. The cavity includes a slot in one of the metal layers and a coupling strip formed adjacent to the slot to provide electromagnetic coupling to other components, such as a voltage controlled oscillator (VCO). The invention can also be applied to other multi-metal semiconductor or wafer level packaging technologies.
    Type: Application
    Filed: November 14, 2005
    Publication date: May 17, 2007
    Inventors: Mark Kintis, Flavia Fong, Thomas Wong, Xing Lan
  • Publication number: 20070069824
    Abstract: A three dimensional (3D) microwave monolithic integrated circuit (MMIC) multi-push voltage controlled oscillator (VCO) and methods of making the same is provided. The 3D MMIC multi-push oscillator includes a plurality of matching frequency oscillators coupled to a phasing ring in substantially equidistantly spaced apart locations. A combined VCO output signal is provided at a central output connection point of the phasing ring. The central output connection point resides on a first plane. An output conductor transition has a first end coupled to the central output connection point and a second end provided as an output to the quad-push VCO. The output conductor transition extends transverse to the first plane and terminates at a second plane separated from the first plane. The multi-push oscillator can be a push-push, quad-push or N-push type VCO based on a particular implementation.
    Type: Application
    Filed: September 27, 2005
    Publication date: March 29, 2007
    Inventors: Mark Kintis, Flavia Fong, Thomas Wong, Xing Lan
  • Publication number: 20070052491
    Abstract: A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.
    Type: Application
    Filed: September 2, 2005
    Publication date: March 8, 2007
    Inventors: Mark Kintis, Flavia Fong, Xing Lan
  • Patent number: 6944437
    Abstract: An electronically programmable multimode circuit is described. More particularly, the present invention is an electronically programmable multimode circuit that includes a first path and a second path wherein a mode and a signal directional flow direction is controlled through the selective biasing of the first path and the second path. A multimode circuit is produced that contains modes such as a phase shifter mode, an IQ modulation mode, an amplifier mode, a mixer mode, and a multiplier mode.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: September 13, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Jeffrey Ming-Jer Yang, Matt Nishimoto, Xing Lan, Michael Battung, Robert Wang, Yun-Ho Chung