Abstract: An optical switch, including an input collimator array, an input micro-electro-mechanical system (MEMS) chip, an output MEMS chip, and an output collimator array. An included angle (?) exists between a surface of a micromirror array on the output MEMS chip and a surface of a lens array of the output collimator array, micromirrors of the micromirror array on the output MEMS chip are arranged at an equal spacing (L) both in a direction parallel to a first direction and in a direction perpendicular to the first direction, where the first direction is a direction of an intersection line of planes to which the surface of the lens array of the output collimator array and the surface of the micromirror array on the output MEMS chip belong, and lenses of the lens array of the output collimator array are arranged with the same arrangement of micromirrors of the output MEMS chip.

Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.

Abstract: Data is received that include values that correspond to a plurality of variables. A score is then generated based on the received data and using a boosted ensemble of segmented scorecard models. The boosted ensemble of segmented scorecard models includes two or more segmented scorecard models. Subsequently, data including the score can be provided (e.g., displayed, transmitted, loaded, stored, etc.). Related apparatus, systems, techniques and articles are also described.

Abstract: A diffusion sheet, a backlight module and a double-sided display device are provided. A transflective layer is provided on one surface of a substrate layer. On one hand, a portion of the light incident from an opposite side of the substrate layer is transmitted to a first display panel via the diffusion sheet; on the other hand, another portion of the light is reflected back to the light guide plate and enters a second display panel on another side of the double-sided backlight module.

Abstract: A display screen includes a light guide plate having a light incident surface and at least two light emitting surfaces, at least two display panels each correspondingly disposed at a corresponding one of the light emitting surfaces of the light guide plate, and a light source disposed at the light incident surface of the light guide plate.

Abstract: At a serving end, modeling samples from a number of modeling scenarios are separately collected, where each modeling sample includes a scenario variable and several basic variables, and where the scenario variable indicates a modeling scenario that the modeling sample belongs to. A modeling sample set is generated by merging the modeling samples. An evaluation model is trained based on modeling samples in the modeling sample set to generate a trained evaluation model, where the trained evaluation model is universal, and where the trained evaluation model is configured to produce a score applicable to multiple service scenarios.

Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.

Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.

Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.

Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed through the semiconductor wafer. A portion of the semiconductor wafer is removed such that a portion of the conductive via extends above the semiconductor wafer. A first insulating layer is formed over the conductive via and semiconductor wafer. A second insulating layer is formed over the first insulating layer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. A portion of the first and second insulating layers is removed simultaneously from over the conductive via by chemical mechanical polishing (CMP). Alternatively, a first insulating layer including an organic material is formed over the conductive via and semiconductor wafer. A portion of the first insulating layer is removed by CMP. A conductive layer is formed over the conductive via and first insulating layer. The conductive layer is substantially planar.

Abstract: Systems and methods for constructing a scoring model and evaluating user credit. An example method for constructing a scoring model may comprise: collecting a plurality of sample datasets, each sample dataset comprising at least one characteristic variable and a corresponding characteristic value; for each characteristic variable, acquiring an interaction index of the characteristic variable with each of one or more other characteristic variables, and determining a clustering index of the characteristic variable according to the interaction indices; selecting a target characteristic variable from the at least one characteristic variable according to the clustering indices of the characteristic variables; dividing the plurality of sample datasets into a plurality of sample dataset subgroups according to the target characteristic variable and the corresponding characteristic value; and constructing a corresponding sub-scoring model for each of the sample dataset subgroups.

Abstract: This application discloses a virtual machine (VM) hot migration method, an apparatus, and a storage medium. A method for virtual machine (VM) hot migration is described. Processing circuitry of a first host machine identifies that a memory block in a storage device of the first host machine is allocated to a virtual machine to migrate. Further, the processing circuitry determines whether the memory block is data-containing. When the memory block is data-containing, interface circuitry of the first host machine sends data in the memory block to a second host machine. When the memory block is not data-containing, the memory block is skipped for migration.

Abstract: Systems, methods, and other embodiments are described. In one embodiment, a system is provided that includes a first processor configured to, in response to a first request for a location of a device, determine a first location of the device, and provide the first location as the location of the device. The system includes a second processor with position update logic configured to, in response to a second request for a location of the device, determine whether the device has moved from the first location. When the device has not moved from the first location the second processor is configured to provide the first location. When the device has moved from the first location, the second processor is configured to determine a second location of the device using less power than the first processor in determining the first location and provide the second location as the location of the device.

Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed partially through the semiconductor wafer. A portion of the semiconductor wafer and conductive via is removed by a chemical mechanical polishing process. The semiconductor wafer and conductive via are coplanar at first and second surfaces. A first insulating layer and a second insulating layer are formed over the conductive via and semiconductor wafer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. An opening in the first and second insulating layers is formed over the conductive via while a second portion of the conductive via remains covered by the first and second insulating layers. A conductive layer is formed over the conductive via and first insulating layer. An interconnect structure is formed over the conductive layer. The semiconductor wafer is singulated into individual semiconductor die.

Abstract: An optical switch, including an input collimator array, an input micro-electro-mechanical system (MEMS) chip, an output MEMS chip, and an output collimator array. An included angle (?) exists between a surface of a micromirror array on the output MEMS chip and a surface of a lens array of the output collimator array, micromirrors of the micromirror array on the output MEMS chip are arranged at an equal spacing (L) both in a direction parallel to a first direction and in a direction perpendicular to the first direction, where the first direction is a direction of an intersection line of planes to which the surface of the lens array of the output collimator array and the surface of the micromirror array on the output MEMS chip belong, and lenses of the lens array of the output collimator array are arranged with the same arrangement of micromirrors of the output MEMS chip.

Abstract: Systems and methods are provided for positioning determination for mobile devices. A system includes: a database configured to store positioning data associated with one or more base stations in a network, and a data management component configured to compare the parameters with one or more parameter thresholds, and update the positioning data based at least in part on the comparison of the parameters and the parameter thresholds. The updated positioning data is used for positioning determination of a mobile device.

Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed partially through the semiconductor wafer. A portion of the semiconductor wafer and conductive via is removed by a chemical mechanical polishing process. The semiconductor wafer and conductive via are coplanar at first and second surfaces. A first insulating layer and a second insulating layer are formed over the conductive via and semiconductor wafer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. An opening in the first and second insulating layers is formed over the conductive via while a second portion of the conductive via remains covered by the first and second insulating layers. A conductive layer is formed over the conductive via and first insulating layer. An interconnect structure is formed over the conductive layer. The semiconductor wafer is singulated into individual semiconductor die.

Abstract: A semiconductor device has a substrate including a plurality of conductive vias formed vertically and partially through the substrate. An encapsulant is deposited over a first surface of the substrate and around a peripheral region of the substrate. A portion of the encapsulant around the peripheral region is removed by a cutting or laser operation to form a notch extending laterally through the encapsulant to a second surface of the substrate opposite the first surface of the substrate. A first portion of the substrate outside the notch is removed by chemical mechanical polishing to expose the conductive vias. A second portion of the substrate is removed by backgrinding prior to or after forming the notch. The encapsulant is coplanar with the substrate after revealing the conductive vias. The absence of an encapsulant/base material interface and coplanarity of the molded substrate results in less over-etching or under-etching and fewer defects.

Abstract: As part of neural network sensitivity analyses, base outputs of hidden layer nodes of a neural network model for non-perturbed variables can be reused when perturbing the variables. Such an arrangement greatly reduces complexity of the calculations required to generate outputs of the model. Related apparatus, systems, techniques and articles are also described.

Abstract: The present disclosure describes systems and techniques relating to determining a real-time position of a mobile device. According to an aspect of the described systems and techniques, a data processing apparatus includes: one or more integrated circuit (IC) devices including a location processor configured to acquire and track measurements of location for a mobile wireless communication device; and a host processor programmed with a host software manager configured to obtain various positioning input signals from different device positioning technologies and assemble a selected set of the various positioning input signals into a unified format; wherein the data processing apparatus includes a hybrid fusion engine configured to receive data from the host software manager in the unified format and calculate a position of the mobile wireless communication device using the received data in accordance with input type information for the received data.