Abstract: Alternating on-die termination impedances are applied within an integrated circuit device to up-convert signal reflections to higher frequencies that are attenuated by the signaling channel as the reflections propagate toward an intended signal receiver. Through this approach, the disruptive effect of reflected signals may be significantly reduced with relatively little overhead within the interconnected integrated circuit devices and little or no change to the printed circuit board or other interconnect medium. Changes to the printed circuit board or other interconnect medium can be made to further increase attenuation over the frequency band of the up-converted reflection and outside of the transmission band of signals of interest.

Abstract: Alternating on-die termination impedances are applied within an integrated circuit device to up-convert signal reflections to higher frequencies that are attenuated by the signaling channel as the reflections propagate toward an intended signal receiver. Through this approach, the disruptive effect of reflected signals may be significantly reduced with relatively little overhead within the interconnected integrated circuit devices and little or no change to the printed circuit board or other interconnect medium. Changes to the printed circuit board or other interconnect medium can be made to further increase attenuation over the frequency band of the up-converted reflection and outside of the transmission band of signals of interest.