Abstract: A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin; 10 parts by weight to 40 parts by weight of a crosslinking agent; and 20 parts by weight to 70 parts by weight of a phosphorus-containing flame retardant which comprises a phosphorus-containing compound represented by Formula (I). The resin composition can be used to make an article, which comprises a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator, and achieves improvement in at least one of the properties including glass transition temperature, ratio of thermal expansion in Z-axis, T288 thermal resistance, flame retardancy, flame retardant migration, flame retardant detachment and bonding gap.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a warpage characteristic lower than that of the insulation layers.