Patents by Inventor Xinghan HE

Xinghan HE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light board, method for manufacturing the same, and LED backlight module and LED backlight device
    Patent number: 12177966
    Abstract: Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: December 24, 2024
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Xinghan He, Danlei Gong, Zhonghai Yan, Hua Fan, Fabo Liu, Youwei Zhan, Weineng Chen, Taotao Song
  • LIGHT BOARD, METHOD FOR MANUFACTURING THE SAME, AND LED BACKLIGHT MODULE AND LED BACKLIGHT DEVICE
    Publication number: 20230217586
    Abstract: Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 6, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Xinghan HE, Danlei GONG, Zhonghai YAN, Hua FAN, Fabo LIU, Youwei ZHAN, Weineng CHEN, Taotao SONG