Abstract: The embodiments of the disclosure discloses an cavity filter in which a sealed resonant cavity is formed by using an adjusting end cover and a body, and a positional relationship between the resonator and the adjusting end cover is changed by using a deformable adjusting end cover. Therefore, during the adjustment of the performance parameters of the cavity filter, the resonant cavity may be kept clean, so as to prevent metal debris or external dust from entering the resonant cavity and affecting the filtering performance of the cavity filter. The adjusting end cover is configured to be driven by the driving body to produce a deformation relative to the resonator. The parameter adjustment range of the cavity filter is improved, so that the cavity filter may adapt to more frequency bands, thereby improving the communication quality of the communication device.

Abstract: The embodiments of the present disclosure disclose a cavity filter. An inner wall of a resonant cavity is provided with a plurality of non-coplanar extension sections inclined toward an outer wall; and meanwhile, each extension section gradually extends toward an end cover from a bottom shell. Thus, a volume of the resonant cavity is increased, making an insertion loss smaller; an outer dimension of the cavity filter is further reduced, making an overall weight lighter; and meanwhile, during casting of a shell portion of the cavity filter, the difficulty of demolding is reduced.

Abstract: A drilling tool includes an outer cylinder; a power rotary shaft arranged in an inner chamber of the outer cylinder; a percussion generator arranged below the power rotary shaft, having a transmission shaft extending in the outer cylinder and can be driven by the power rotary shaft to rotate around its axis, an output main shaft engaged with a lower end of the transmission shaft so as to be driven by the transmission shaft to rotate about its axis and is movable relative to the transmission shaft along an axial direction, and an percussion assembly The percussion assembly is arranged between an annulus formed between the upper end of the output main shaft and the outer cylinder and can generate reciprocating impact along the axial direction on the output main shaft. A drilling bit connected with the output main shaft extending out of the inner chamber of the outer cylinder.

Abstract: Disclosed is a resonant filter, which includes a housing including an input hole and an output hole, an input resonator including an input resonant body and an input port extending from the input resonant body and out of the housing through the input hole, and an output resonator including an output resonant body and an output port extending from the output resonant body and out of the housing through the output hole. The input resonator and the output resonator are fixed in the housing. The input resonator body and the output resonator body, which are sheets with a metal surface or metal sheets, respectively include a resonant rod with an upright segment, an extension segment extending from the upright segment and one end of which away from the extension segment is connected to the housing, and a first branch extending from the extension segment away from the upright segment.

Abstract: Organic luminescent material, includes: host material, TADF sensitizer, and fluorescent-luminescent material; wherein absolute value of difference between LUMO level of the host material and LUMO level of the TADF sensitizer is not more than 0.4 eV, and absolute-value of difference between HOMO level of the host material and HOMO level of the TADF sensitizer is not more than 0.4 eV; absolute-value of LUMO level of the fluorescent-luminescent material is not more than absolute-value of the LUMO level of the host material and the LUMO level of the TADF sensitizer, and/or absolute-value of HOMO level of the fluorescent-luminescent material is not less than an absolute-value of the HOMO level of the host material and absolute-value of the HOMO level of the TADF sensitizer; and emission-spectrum of the host material overlaps an absorption-spectrum of the TADF sensitizer, and emission-spectrum of the TADF sensitizer overlaps absorption-spectrum of the fluorescent-luminescent material.

Abstract: A speed-enhancing drilling tool includes an upstream drill string (10), which has a drive motor and a first driving rod coupled therewith, a downstream drilling bit; and a percussive device connected between the upstream drilling string and the downstream drilling bit. The first driving rod extending axially and the drive motor are configured to drive the first driving rod in rotation. The percussive device has a rotary driving part having an upper end engaged with the first driving rod to rotate together therewith; and a rotary working part having an upper end engaged with a lower end of the rotary driving part and a lower end connected with the downstream drilling bit. The rotary working part can be driven by the rotary driving part to rotate about its axis, and axially movable relative thereto; and a percussion generating part arranged around the rotary working part.

Abstract: A method of processing a substrate that includes: forming recesses in a first mask layer over a mask stack including a lower hardmask, a middle mask, and an upper hardmask, the recesses defining an initial pattern including a plurality of spacer structures, each of the spacer structures having a first sidewall and an opposite second sidewall, the first sidewall having a different height from the second sidewall; etching the upper hardmask, selectively to the middle mask, to transfer the initial pattern to the upper hardmask; etching the middle mask, selectively to the lower hardmask and the patterned upper hardmask, to transfer a pattern of the patterned upper hardmask to the middle mask; and etching the lower hardmask, selectively to the patterned middle mask, to transfer a pattern of the patterned middle mask to the lower hardmask.

Abstract: Provided are a coaxial filter and a communication radio frequency device. The communication radio frequency device includes the coaxial filter. The coaxial filter includes a housing having a resonant cavity, a cover plate, and a resonator. The cover plate corresponds to the resonant cavity and covers the housing. The resonator includes plurality of elastic pieces, a connection portion, and a body portion which are sequentially connected from one end to another end. The connection portion is connected to a bottom of the resonant cavity.

Abstract: A cavity filter includes a housing, an input resonator and an output resonator. The input resonator includes a first sheet-like resonant body, an input end extending outward from one side of the first sheet-like resonance body and a first branch extending outward from the first sheet-like resonance body and/or the input end, and the input end extends out of the housing through the input through hole. The output resonator includes a second sheet-like resonant body, an output end extending outward from one side of the second sheet-like resonance body, and a second branch extending outward from the second sheet-like resonance body and/or the output end, and the output end extends out of the housing through the output through hole. The lengths of the first branch and the second branch are both a quarter wavelength of a resonant frequency of the cavity filter.

Abstract: A method is described for patterning a dielectric layer disposed over a semiconductor substrate layer. The patterning process includes forming a patterned hard mask layer over the dielectric layer, the patterned hard mask layer exposing a portion of a major surface of the dielectric layer. A portion of the dielectric layer is removed by a cyclic etch process, where performing one cycle of the cyclic etch process comprises forming a capping layer selectively over the patterned hard mask layer and performing a timed etch process that removes material from the dielectric layer. In another method, the deposition over the hard mask and the removal of the portion of the dielectric layer are performed concurrently.

Abstract: Methods are disclosed that provide improved via profile control by forming atomic layer deposition (ALD) liners to protect side walls of vias during subsequent etch processes. ALD liners can be used for BEOL etch processes as well as for full self-aligned via (FSAV) processes and/or other processes. For one embodiment, ALD liners are used as protection or sacrificial layers for vias to reduce damage during multilayer via or trench etch processes. The ALD liners can also be deposited at different points within process flows, for example, before or after removal of organic planarization layers. The use of ALD liners facilitates shrinking of via critical dimensions (CDs) while still controlling via profiles for various process applications including dual Damascene processes and FSAV processes. In addition, the use of ALD liners improves overall CD control for via or hole formation as well as device yield and reliability.

Abstract: Disclosed is a cavity filter including a housing, and a first sheet-shaped resonant rod, a second sheet-shaped resonant rod, and a third sheet-shaped resonant rod disposed in the housing. The first sheet-shaped resonant rod includes a first upright section and a first extension section extending from one side of the first upright section. The second sheet-shaped resonant rod includes a second upright section and a second extension section extending from one side of the second upright section. The second upright section, the first upright section, and the third sheet-shaped resonant rod are connected to the housing, and the first extension section and the second extension section extend toward each other. Capacitive coupling is formed between the first and second sheet-shaped resonant rods. Capacitive coupling or inductive coupling is formed between the second and third sheet-shaped resonant rods and between the first and third sheet-shaped resonant rods.

Abstract: In one embodiment, a method includes providing a substrate comprising a source/drain contact region and a dummy gate, forming a first etch stop layer aligned to the source/drain contact region, where the first etch stop layer does not cover the dummy gate. The method may include forming a second etch stop layer over the first etch stop layer, the second etch stop layer covering the first etch stop layer and the dummy gate. The method may include converting the dummy gate to a metal gate. The method may include removing the second etch stop layer using a plasma etching process. The method may include removing the first etch stop layer.

Abstract: Methods and systems for selective deposition of conductive a cap for FAV features are described. In an embodiment, a method may include receiving a substrate having an interlayer dielectrics (ILD) layer, the ILD layer having a recess, the recess having a conductive layer formed therein, the conductive layer comprising a first conductive material. Additionally, such a method may include forming a cap within a region defined by the recess and in contact with a surface of the conductive layer, the cap comprising a second conductive material. The method may also include forming a conformal etch stop layer in contact with a surface of the cap and in contact with a region of the ILD layer. Further, the method may include selectively etching the etch stop layer using a plasma etch process, wherein the plasma etch process removes the etch stop layer selective to the second conductive material comprising the cap.

Abstract: Disclosed is a resonant filter, which includes a housing including an input hole and an output hole, an input resonator including an input resonant body and an input port extending from the input resonant body and out of the housing through the input hole, and an output resonator including an output resonant body and an output port extending from the output resonant body and out of the housing through the output hole. The input resonator and the output resonator are fixed in the housing. The input resonator body and the output resonator body, which are sheets with a metal surface or metal sheets, respectively include a resonant rod with an upright segment, an extension segment extending from the upright segment and one end of which away from the extension segment is connected to the housing, and a first branch extending from the extension segment away from the upright segment.

Abstract: A method is described for patterning a dielectric layer disposed over a semiconductor substrate layer. The patterning process includes forming a patterned hard mask layer over the dielectric layer, the patterned hard mask layer exposing a portion of a major surface of the dielectric layer. A portion of the dielectric layer is removed by a cyclic etch process, where performing one cycle of the cyclic etch process comprises forming a capping layer selectively over the patterned hard mask layer and performing a timed etch process that removes material from the dielectric layer. In another method, the deposition over the hard mask and the removal of the portion of the dielectric layer are performed concurrently.

Abstract: A method for processing a substrate includes performing a first etch process to form a plurality of partial features in a dielectric layer disposed over the substrate; performing an irradiation process to irradiate the substrate with ultra-violet radiation having a wavelength between 100 nm and 200 nm; and after the irradiation process, performing a second etch process to form a plurality of features from the plurality of partial features.

Abstract: Provided is a dielectric waveguide filter that includes a dielectric main body. A plurality of isolation slots and frequency tuning blind holes are provided in the dielectric main body. At least two port signal transmission holes are further provided in the dielectric main body. The at least two port signal transmission holes and at least part of the plurality of frequency tuning blind holes are disposed on two opposite sides of the dielectric main body. In a thickness direction of the dielectric main body, the at least two port signal transmission holes do not overlap with the at least part of the plurality of frequency tuning blind holes. The dielectric waveguide filter according to embodiments of this disclosure achieves miniaturization while improving out-of-band rejection capability.

Abstract: A method for processing a substrate includes performing a first etch process to form a plurality of partial features in a dielectric layer disposed over the substrate; performing an irradiation process to irradiate the substrate with ultra-violet radiation having a wavelength between 100 nm and 200 nm; and after the irradiation process, performing a second etch process to form a plurality of features from the plurality of partial features.

Abstract: Methods are disclosed that provide improved via profile control by forming atomic layer deposition (ALD) liners to protect side walls of vias during subsequent etch processes. ALD liners can be used for BEOL etch processes as well as for full self-aligned via (FSAV) processes and/or other processes. For one embodiment, ALD liners are used as protection or sacrificial layers for vias to reduce damage during multilayer via or trench etch processes. The ALD liners can also be deposited at different points within process flows, for example, before or after removal of organic planarization layers. The use of ALD liners facilitates shrinking of via critical dimensions (CDs) while still controlling via profiles for various process applications including dual Damascene processes and FSAV processes. In addition, the use of ALD liners improves overall CD control for via or hole formation as well as device yield and reliability.