Patents by Inventor Xingjie (Steven) Ge

Xingjie (Steven) Ge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230030112
    Abstract: A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adjacent heat dissipation units are each coupled with one of the heat dissipation fins of a second heat dissipation unit of the pair of adjacent heat dissipation units by a coupling structure. The heat dissipation fins of the first heat dissipation unit and the heat dissipation fins of the second heat dissipation unit are displaceable with respect to each other within a certain range.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 2, 2023
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: WenYu (Vindy) Liu, Xingjie (Steven) Ge, Xinbo (Polly) Liu
  • Publication number: 20230035520
    Abstract: A connector includes a housing having a cavity and a terminal assembly accommodated in the cavity and including a first terminal. The first terminal has a first mating portion, a first connecting portion, and a first mating beam extending from the first mating portion to the first connecting portion. The terminal assembly includes an inserting block usable with the first terminal and having an inserting block frame. The inserting block frame has a first passage and a preloading portion. The first passage allows the first mating beam to pass therethrough. The preloading portion supports the first mating beam and applies a pre-pressing force to the first mating beam.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 2, 2023
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Holdings (Bermuda) No. 7 Limited
    Inventors: Jiwang (Arthur) Jin, WenYu (Vindy) Liu, Xingjie (Steven) Ge, Kuo-Wei Chang