Patents by Inventor Xingrong Wang

Xingrong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933459
    Abstract: A lamp including electrical leads extending into a supporting stem that are in communication with a base electrode for engagement to a light fixture; and a light engine comprising light emitting diode filaments that are in electrical communication with the electrical leads. The light emitting diode filaments including a circuit having a plurality of contact pads arranged along a length of a substrate. The light emitting diode filaments further include light emitting diode (LED) chips engaged to the contact pads along the length of the substrate to provide that the light emitting diode (LED) chips are electrically connected in series. In some embodiments, each light emitting diode (LED) chip includes at least a light transmission surface that is in contact with an individual portion of phosphor for the LED chip. In other embodiments, a phosphor layer extends over an island of LED chips.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: March 19, 2024
    Assignee: LEDVANCE LLC
    Inventors: Xingrong Wang, Tianzheng Jiang, Ming Li
  • Publication number: 20230341095
    Abstract: A lamp including electrical leads extending into a supporting stem that are in communication with a base electrode for engagement to a light fixture; and a light engine comprising light emitting diode filaments that are in electrical communication with the electrical leads. The light emitting diode filaments including a circuit having a plurality of contact pads arranged along a length of a substrate. The light emitting diode filaments further include light emitting diode (LED) chips engaged to the contact pads along the length of the substrate to provide that the light emitting diode (LED) chips are electrically connected in series. In some embodiments, each light emitting diode (LED) chip includes at least a light transmission surface that is in contact with an individual portion of phosphor for the LED chip. In other embodiments, a phosphor layer extends over an island of LED chips.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Inventors: Xingrong Wang, Tianzheng Jiang, Ming Li