Abstract: An optical multiplexing system comprises a wavelength division multiplexing (WDM) device, an incoming light input to the WDM device, and an exiting light output from the WDM device. The WDM device comprises a WDM filter, an incident light is incident at the WDM filter having an incident angle at the WDM filter. The incident light is partially transmitted through the WDM filter and partially reflected from the WDM filter. An angle formed by the incoming light and the exiting light is larger than twice of the incident angle at the WDM filter.

Abstract: The optical module disclosed herein has a first lens, a second lens and an array lens arranged sequentially along the main optical axis. The first lens shapes a beam along the first direction of the main optical axis. The second lens shapes the beam along the second direction of the main optical axis. The array of array lenses is arranged along the second direction. A laser beam enters the second lens after passing through the first lens. The second lens diffuses the laser beam along the second direction. After the laser beam is converted from a Gaussian distribution to a flat-top distribution in the second direction, the laser beam is emitted through the array lens. The first direction and the second direction are perpendicular to each other.

Abstract: The invention discloses an optical module and a laser system, and relates to the technical field of optics. The optical module comprises a first light emitting assembly, a second light emitting assembly, and a homogenizing lens group arranged on the light emitting sides of the first light emitting assembly and the second light emitting assembly; Light beams emitted by the first light emitting assembly and the second light emitting assembly are respectively and vertically incident on the light incident side of the homogenizing lens group, and the homogenizing lens group homogenizes and emits the light beams incident by the first light emitting assembly and the second light emitting assembly to form light spots. The optical module and the laser system are small and compact in structure, and can realize diversified forms of output light spots, so that the optical module and the laser system can meet different requirements.

Abstract: Disclosed herein is a cooler of a semiconductor laser. The cooler includes a heat sink comprising a first surface and a second surface opposite the first surface; a first conductive layer and a second conductive layer, disposed on the first surface and not short-circuited to each other; and a conductive connector comprising a first end part, a second end part, and a first connection part connecting the first end part and the second end part. The first end part is on the first conductive layer. The second end part is on the second surface of the heat sink and insulated from the heat sink. The first connection part is disposed at a first non-opposite end of the first conductive layer on the heat sink.

Abstract: The invention provides a cooler of the semiconductor laser, a semiconductor laser comprising the cooler, and a stack of the semiconductor lasers, all of which can be applied to high power devices, and have high environmental adaptability and reliability.

Abstract: The present invention provides a semiconductor laser module and a method for application in noninvasive medical treatment. The module comprises a direct-output type semiconductor laser light source and a beam shaping device disposed in the light-exit direction of the direct-output type semiconductor laser light source. The beam shaping device comprises a light reflection component. The light reflection component is configured to enable laser beams outputted by the direct-output type semiconductor laser light source to be uniform. Based on the semiconductor laser module and the method provided in the present invention, the objective of treatment can be achieved by means of extracorporeal irradiation in a case in which no harm is done to a human body, costs are low, and the treatment effect is good.

Abstract: Disclosed is a bilateral cooling type semiconductor laser system for medical beauty use, the contact window of which can make direct contact with the skin. The bilateral cooling type semiconductor laser system for medical beauty use comprises a semiconductor laser array, an optical waveguide located on the front end of the light emitting surface of the semiconductor laser array, a transparent contact window abutting against the light outlet end of the optical waveguide, a pair of cooling blocks and a first water throughflow block. The first water throughflow block is divided into a basal part and a U-shaped head located above the basal part, and the middle part and back part of the optical waveguide are embedded in the U-type header. A fixed block is provided above the corresponding optical waveguide to press and fix the optical waveguide. There is still a space between the optical waveguide and the side wall of the U-type header.

Abstract: A semiconductor laser system for laser medical cosmetology, comprising a semiconductor laser array (1), an optical waveguide (2), a boss-shaped transparent contact window (3) located at the light outlet end of the optical waveguide (2), and a refrigeration block (4) for conduction cooling of the contact window (3); the refrigeration block (4) consists of a base portion and a hollow head above the base portion; the front part of the hollow head presses against and is tightly fastened to the whole side wall of the contact window (3); the light outlet end of the optical waveguide (2) is located in the cavity of the hollow head, and has a gap between the waveguide and the inner wall of the hollow head; a thermoelectric semiconductor refrigerator (5) is disposed below the base portion of the refrigeration block (4); a first water supply block (6) is disposed below the thermoelectric semiconductor refrigerator (5); and a second water supply block (16) for heat dissipation is installed in the semiconductor laser arr

Abstract: Disclosed is a bilateral cooling type semiconductor laser system for medical beauty use, the contact window of which can make direct contact with the skin. The bilateral cooling type semiconductor laser system for medical beauty use comprises a semiconductor laser array, an optical waveguide located on the front end of the light emitting surface of the semiconductor laser array, a transparent contact window abutting against the light outlet end of the optical waveguide, a pair of cooling blocks and a first water throughflow block. The first water throughflow block is divided into a basal part and a U-shaped head located above the basal part, and the middle part and back part of the optical waveguide are embedded in the U-type header. A fixed block is provided above the corresponding optical waveguide to press and fix the optical waveguide. There is still a space between the optical waveguide and the side wall of the U-type header.

Abstract: A semiconductor laser system for laser medical cosmetology, comprising a semiconductor laser array (1), an optical waveguide (2), a boss-shaped transparent contact window (3) located at the light outlet end of the optical waveguide (2), and a refrigeration block (4) for conduction cooling of the contact window (3); the refrigeration block (4) consists of a base portion and a hollow head above the base portion; the front part of the hollow head presses against and is tightly fastened to the whole side wall of the contact window (3); the light outlet end of the optical waveguide (2) is located in the cavity of the hollow head, and has a gap between the waveguide and the inner wall of the hollow head; a thermoelectric semiconductor refrigerator (5) is disposed below the base portion of the refrigeration block (4); a first water supply block (6) is disposed below the thermoelectric semiconductor refrigerator (5); and a second water supply block (16) for heat dissipation is installed in the semiconductor laser arr

Abstract: A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

Abstract: A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

Abstract: A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A high-power semiconductor laser includes a support block, an anode metal plate, a cathode metal plate and a chip. The support block has a step, and the two ends of the support block have bosses, in which there are screw holes. The chip is welded to an insulation plate, which is attached to the support block. The anode metal plate and the cathode metal plate are, respectively, welded with an anode insulation plate and a cathode insulation plate, which are welded on the step of the support block. The cathode of the chip is connected with a metal connecting plate. The metal connecting plate is connected to the anode metal plate and the cathode metal plate. The insulation plate and the anode metal plate are bonded using a gold wire in press-welding.

Abstract: This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A high-power semiconductor laser includes a support block, an anode metal plate, a cathode metal plate and a chip. The support block has a step, and the two ends of the support block have bosses, in which there are screw holes. The chip is welded to an insulation plate, which is attached to the support block. The anode metal plate and the cathode metal plate are, respectively, welded with an anode insulation plate and a cathode insulation plate, which are welded on the step of the support block. The cathode of the chip is connected with a metal connecting plate. The metal connecting plate is connected to the anode metal plate and the cathode metal plate. The insulation plate and the anode metal plate are bonded using a gold wire in press-welding.

Abstract: A semiconductor laser is provided comprising a semiconductor substrate, an active region, a ridge waveguide, a driving electrode structure, and a micro-heating element structure. The micro-heating element structure comprises a pair of heating element strips extending along the longitudinal dimension of the semiconductor laser. The heating element strips are on opposite sides of the ridge waveguide such that one of the heating element strips extends along one side of the ridge waveguide while a remaining heating element strip extends along another side of the ridge waveguide.

Abstract: The present invention relates to methods for modulating a semiconductor laser and wavelength matching to a wavelength converter using monolithic micro-heaters integrated in the semiconductor laser. The present invention also relates to wavelength matching and stabilization in laser sources in general, without regard to whether the laser is modulated or whether second harmonic generation is utilized in the laser source. According to one embodiment of the present invention, a method of compensating for thermally induced patterning effects in a semiconductor laser is provided where the laser's heating element driving current IH is set to a relatively high magnitude when the laser's driving current ID is at a relatively low magnitude. Additional embodiments are disclosed and claimed.