Patents by Inventor Xingwu DAI

Xingwu DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11837384
    Abstract: A corona-resistant enameled round wire and preparation method of making such which is suitable for electric vehicle motors and has a copper conductor and an insulating layer. The insulating layer clads the copper conductor and has in sequence from inside to outside, a corona- resistant polyamideimide coating, a corona-resistant special resin coating, a corona-resistant polyimide coating, a corona-resistant modified silicone resin coating, and a corona-resistant polyamideimide coating.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: December 5, 2023
    Assignees: SHANGHAI XPT TECHNOLOGY LIMITED, SUZHOU JUFENG ELECTRICAL INSULATION SYSTEM CO., LTD.
    Inventors: Ling Zhang, Xingwu Dai, Yanjun Cai, Ge Qin, Lu Bi, Yu Xia, Cheng Zhou, Guo Li, Qingquan Lei
  • Publication number: 20230047864
    Abstract: Disclosed are a corona-resistant enameled round wire and preparation method therefor. The corona-resistant enameled round wire is suitable for electric vehicle motors and comprises a copper conductor and an insulating layer, wherein the insulating layer clads the copper conductor and comprises, in sequence from inside to outside, a corona-resistant polyamideimide coating, a corona-resistant special resin coating, a corona-resistant polyimide coating, a corona-resistant modified silicone resin coating, and a corona-resistant polyamideimide coating.
    Type: Application
    Filed: August 11, 2022
    Publication date: February 16, 2023
    Inventors: Ling ZHANG, Xingwu DAI, Yanjun CAI, Ge QIN, Lu BI, Yu XIA, Cheng ZHOU, Guo LI, Qingquan LEI