Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

Abstract: Provided is a resin composition and articles made therefrom, wherein the resin composition comprises 40 to 80 parts by weight of maleimide monomer and/or resin; 10 to 30 parts by weight of oxydianiline type benzoxazine monomer and/or resin; 10 to 40 parts by weight of flame retardant; wherein the flame retardant comprises one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane; and wherein the metal of the metal phosphinate flame retardant is selected from Group 13 elements. By using maleimide monomer and/or resin, oxydianiline type benzoxazine monomer and/or resin and flame retardant comprising one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C.

Abstract: Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40° C. to 140° C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260° C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

Abstract: Provided is a resin composition and articles made therefrom, wherein the resin composition comprises 40 to 80 parts by weight of maleimide monomer and/or resin; 10 to 30 parts by weight of oxydianiline type benzoxazine monomer and/or resin; 10 to 40 parts by weight of flame retardant; wherein the flame retardant comprises one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane; and wherein the metal of the metal phosphinate flame retardant is selected from Group 13 elements. By using maleimide monomer and/or resin, oxydianiline type benzoxazine monomer and/or resin and flame retardant comprising one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C.

Abstract: Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40° C. to 140° C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260° C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.