Abstract: High speed, high density I/O connector assemblies. An I/O connector assembly includes a cage and a heat dissipation member. The cage includes a top wall having an opening and a channel accessible from the front. The heat dissipation member includes a base disposed at the top of the cage, multiple sections separated by gaps, and a contact portion protruding from the base in a first direction into the channel through the opening of the top wall. Each section includes fins protruding from the base in a direction opposite to the first direction. The heat dissipation member comprises a layer of micro thermal interface material at a contact interface. Techniques described herein, including the structure and material composition of components, can provide sufficient heat dissipation to enable high speed, high density I/O connector assemblies that nonetheless can be economically manufactured and meet the dimensional requirements of an OSFP-XD standard.

Abstract: A self-supervised multimodal structured illumination microscopic reconstruction method comprises: exciting a biological sample with structured illumination to obtain J raw fluorescence image sequences, wherein J is an integer greater than or equal to 1, each raw fluorescence image sequence comprises S fluorescence images, S being an integer greater than or equal to 2; generating a training set for each raw fluorescence image sequence among the J raw fluorescence image sequences; training a denoising neural network on the basis of the training set; and performing super-resolution reconstruction on the S fluorescence images in each of the J raw fluorescence image sequences using a standard structured illumination super-resolution reconstruction algorithm to form a super-resolution image, which is input into the denoising neural network to obtain a final super-resolution reconstructed image.

Abstract: An integrated green methanol synthesis apparatus with heat transfer, heat storage and heat exchange by molten salt is provided. A molten salt with a wide temperature range, a high specific heat capacity and an atmospheric pressure is used as a heat transfer medium, a heat storage medium circulation system is provided to continuously transfer reaction heat generated in an inner cavity to an outer cavity to heat a feed gas, and the heat generated in the inner cavity is stored in the molten salt medium in the form of sensible heat, so that the green methanol synthesis apparatus achieves integration of functions of heat transfer, heat storage and heat exchange and can effectively solve the problems in the existing methanol synthesis technology, such as low temperature of the feed gas entering the synthesis apparatus, a large number of accessory devices, and large space occupation.

Abstract: A self-supervised multimodal structured illumination microscopic reconstruction method comprises: exciting a biological sample with structured illumination to obtain J raw fluorescence image sequences, wherein J is an integer greater than or equal to 1, each raw fluorescence image sequence comprises S fluorescence images, S being an integer greater than or equal to 2; generating a training set for each raw fluorescence image sequence among the J raw fluorescence image sequences; training a denoising neural network on the basis of the training set; and performing super-resolution reconstruction on the S fluorescence images in each of the J raw fluorescence image sequences using a standard structured illumination super-resolution reconstruction algorithm to form a super-resolution image, which is input into the denoising neural network to obtain a final super-resolution reconstructed image.

Abstract: A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

Abstract: A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

Abstract: A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112GBps and beyond.

Abstract: A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

Abstract: A high performance connector that provides heat dissipation sufficient to support operation of high power consuming QSFP-DD transceivers. The connector may be housed in a cage with a first channel to receive a transceiver. A connector port may be aligned with the first channel, and a heat transfer element comprising a compressible portion may make mechanical and thermal contact with a transceiver inside the first channel. The compressible portion may be urged to contact a transceiver by a biasing element. The heat transfer element may be thermally coupled to a heat dissipating element outside the cage. The cage may have multiple channels, and the heat transfer element may be installed in a channel between other channels, each receiving transceivers such that the heat transfer element may receive heat from multiple transceivers.

Abstract: A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.

Abstract: A cage for a stacked I/O connector that provides heat dissipation sufficient to support operation of QSFP-DD transceivers with a conventionally-sized cooling fan. The cage includes a second channel, between a first and a third channel that are sized and positioned adjacent ports of a connector so as to receive two transceivers. A face of the second channel may have a pattern of openings that enables a high airflow yet blocks electromagnetic radiation that would otherwise contribute to EMI. An element, adjacent the channel that similarly has a pattern of holes enabling high airflow, may further block EMI.

Abstract: The present disclosure relates to a method for multi-color fluorescence imaging under a single exposure, an imaging method and system. The imaging system includes: a fluorescence microscope, configured to obtain a real image of the sample; a spatial mask, disposed behind the fluorescence microscope, and configured to perform mask modulation on the real image of the sample; a 4f system, disposed behind the spatial mask, in which the real image of the sample passes through the spatial mask to the 4f system; an optical granting, disposed on a Fourier plane in middle of the 4f system, and configured to split the real image of the sample to obtain a split real image; and an image sensor, configured to obtain the split real image to obtain an image of the sample. The present disclosure advantages of improving imaging rate in multi-spectrum fluorescence microscopy.

Abstract: A cage for a stacked I/O connector that provides heat dissipation sufficient to support operation of QSFP-DD transceivers with a conventionally-sized cooling fan. The cage includes a second channel, between a first and a third channel that are sized and positioned adjacent ports of a connector so as to receive two transceivers. A face of the second channel may have a pattern of openings that enables a high airflow yet blocks electromagnetic radiation that would otherwise contribute to EMI. An element, adjacent the channel that similarly has a pattern of holes enabling high airflow, may further block EMI.

Abstract: The present disclosure relates to a method for multi-color fluorescence imaging under a single exposure, an imaging method and system. The imaging system includes: a fluorescence microscope, configured to obtain a real image of the sample; a spatial mask, disposed behind the fluorescence microscope, and configured to perform mask modulation on the real image of the sample; a 4f system, disposed behind the spatial mask, in which the real image of the sample passes through the spatial mask to the 4f system; an optical granting, disposed on a Fourier plane in middle of the 4f system, and configured to split the real image of the sample to obtain a split real image; and an image sensor, configured to obtain the split real image to obtain an image of the sample. The present disclosure advantages of improving imaging rate in multi-spectrum fluorescence microscopy.