Patents by Inventor Xingyin XIONG

Xingyin XIONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System-level packaging method and packaging system based on 3D printing
    Patent number: 10643862
    Abstract: The present invention discloses a system-level packaging method and packaging system based on 3D printing.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 5, 2020
    Assignee: INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
    Inventors: Zongwei Li, Xingyin Xiong, Kedu Han, Changchun Yang
  • SYSTEM-LEVEL PACKAGING METHOD AND PACKAGING SYSTEM BASED ON 3D PRINTING
    Publication number: 20190228986
    Abstract: The present invention discloses a system-level packaging method and packaging system based on 3D printing.
    Type: Application
    Filed: April 25, 2018
    Publication date: July 25, 2019
    Applicant: INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
    Inventors: Zongwei LI, Xingyin XIONG, Kedu HAN, Changchun YANG