Abstract: In an embodiment, an array substrate includes a substrate having a display region and a package region surrounding the display region, wherein the display region comprises a side region adjacent to the package region; a pixel definition layer disposed on the display region of the substrate, wherein the pixel definition layer is formed with a plurality of recesses and a plurality of corresponding protrusions surrounding each recess, and each recess and each protrusion correspond to the side region; and a cathode trace disposed on a surface of each protrusion and a bottom surface of each recess, wherein a gap exists between the cathode trace on each protrusion and the cathode trace in each recess.

Abstract: A package structure and a packaging method of an organic light emitting diode (OLED) device of the present invention utilize an organic layer disposed between a first organic reinforcing layer and a second organic reinforcing layer to improve water oxygen barrier performance of the OLED device, and each of the first organic reinforcing layer and the second organic reinforcing layer includes organic fluoride. The organic fluoride combines with silicon dioxide through chemical bonds to render organic and inorganic interface bonding performance superior to simple physical stacking, thereby to extend the lifespan of the OLED device.