Patents by Inventor Xingyun Yang

Xingyun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639025
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 2, 2023
    Assignee: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua
  • Publication number: 20210146610
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Application
    Filed: April 3, 2019
    Publication date: May 20, 2021
    Applicant: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua