Abstract: A light-emitting substrate includes a driving circuit layer, a first light-emitting layer located on a side of the driving circuit layer, a second light-emitting layer located on a side of the first light-emitting layer away from the driving circuit layer, and a third light-emitting layer located on a side of the second light-emitting layer away from the driving circuit layer. The pixel circuit layer includes pixel circuits. The first light-emitting layer includes first light-emitting devices respectively coupled to the pixel circuits. The second light-emitting layer includes second light-emitting devices respectively coupled to the pixel circuits. The third light-emitting layer includes third light-emitting devices respectively coupled to the pixel circuits. Orthographic projections of a first light-emitting device, a second light-emitting device and a third light-emitting device on the driving circuit layer do not necessarily coincide with each other.

Abstract: Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.

Abstract: A chip on film includes: a flexible substrate; and a multilayer wiring structure disposed on the flexible substrate. The multilayer wiring structure includes a first wiring layer, a first insulation layer and a second wiring layer, which are sequentially arranged in a direction towards the flexible substrate the flexible substrate. The first wiring layer includes a first conductive material and the second wiring layer includes a second conductive material. The chip on film further includes: pins, at least part of which are in the first wiring layer; first via holes in the first insulation layer; and a second wire and a second wire leading portion in the second wiring layer, which are electrically connected to each other. More than one pin is electrically connected to the second wire leading portion through more than one first via hole, respectively.

Abstract: A display panel and a display device are provided. The display panel includes a plurality of display units, each display unit includes a transparent area, and the display panel further includes a base substrate and a composite functional layer. The composite functional layer is provided on a side of the base substrate and has a first through-hole formed therein, and the first through-hole is provided in the transparent area. The composite functional layer includes a composite transparent layer and a light-shielding layer. The composite transparent layer includes a plurality of transparent functional layers, and includes a light-transmitting part surrounding the first through-hole. An orthographic projection of the light-shielding layer on the base substrate covers an orthographic projection of at least a portion of the light-transmitting part on the base substrate.

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.

Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.

Abstract: A patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.

Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.

Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.

Abstract: The disclosure discloses an antenna-in-package structure, including a first substrate and a second substrate. A first surface of the first substrate includes a first patch antenna, the second substrate is connected to a second surface of the first substrate, and the second substrate is provided with a third surface and a fourth surface. The third surface includes a second patch antenna, and a projection of the second patch antenna on the first surface at least partially overlaps the first patch antenna. A cavity is disposed between the first substrate and the second substrate, and the second patch antenna is separated from the second surface by the cavity. The fourth surface includes a radio frequency element, and the radio frequency element sends and receives a radio frequency signal by using the first patch antenna and the second patch antenna.

Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.