Patents by Inventor Xinhong Su

Xinhong Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards and methods for manufacturing same
    Patent number: 9900978
    Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: February 20, 2018
    Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder PCB Development Co., Ltd., Chongqing Founder Hi-Tech Electronic Inc.
    Inventors: Xinhong Su, George Dudnikov, Jr., Shuhan Shi
  • Methods and apparatuses for detecting registration offsets
    Patent number: 9232632
    Abstract: A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a printed circuit board (PCB) substrate. The first pattern has a reference scale. The method further includes transferring a second pattern to a metal layer on a second side opposite to the first side of the PCB substrate. The second pattern has a measurement scale. The second pattern is transferred by aligning an origin of the measurement scale with an origin of the reference scale in an apparatus such that at least a portion of the reference scale is overlapped with the measurement scale. The method includes etching the metal layers of the PCB substrate and measuring an offset in the patterns on the PCB substrate by using the reference scale and the measurement scale.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: January 5, 2016
    Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech Hi-Density Electronics Co., Ltd.
    Inventors: Xinhong Su, Chen Chen
  • PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
    Publication number: 20140190733
    Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.
    Type: Application
    Filed: October 29, 2012
    Publication date: July 10, 2014
    Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., CHONGQING FOUNDER HI-TECH ELECTRONIC INC.
    Inventors: George Dudnikov, JR., Xinhong Su, Shuhan Shi