Patents by Inventor Xinkun Huang

Xinkun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-site concurrent wafer probe magnetic circuit testing
    Patent number: 11927604
    Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: March 12, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Xinkun Huang, Dok Won Lee, Christopher Michael Ledbetter, Bret Alan Dahl, Roy Deidrick Solomon
  • MULTI-SITE CONCURRENT WAFER PROBE MAGNETIC CIRCUIT TESTING
    Publication number: 20210356497
    Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 18, 2021
    Applicant: Texas Instruments Incorporated
    Inventors: Xinkun Huang, Dok Won Lee, Christopher Michael Ledbetter, Bret Alan Dahl, Roy Deidrick Solomon
  • HIGH VOLTAGE INTEGRATED CIRCUIT TESTING INTERFACE ASSEMBLY
    Publication number: 20210231729
    Abstract: An integrated circuit testing assembly that includes: (i) a first slug configured to contact a first surface of a first set of pins of an integrated circuit; (ii) a second slug configured to contact a second surface of the first set of pins of the integrated circuit; (iii) a third slug configured to contact a first surface of a second set of pins of the integrated circuit; and (iv) a fourth slug configured to contact a second surface of the second set of pins of the integrated circuit.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 29, 2021
    Inventors: Ming-Chuan You, Andrew Patrick Couch, Phillip Marcus Blitz, Xinkun Huang, Chi-Tsung Lee, Roy Deidrick Solomon, Enis Tuncer