Abstract: Provided are a display substrate, a preparation method thereof and a display apparatus. The display substrate includes a first semi-conductive layer, a first conductive layer, a second conductive layer, a second semi-conductive layer, a third conductive layer, an interlayer insulating layer and an organic layer stacked on a substrate. The first semi-conductive layer includes an active layer of a polysilicon transistor, the first conductive layer includes a gate electrode of a polysilicon transistor and a first electrode plate of a storage capacitor, the second conductive layer includes a second electrode plate of a storage capacitor, the second semi-conductive layer includes an active layer of an oxide transistor, and the third conductive layer includes a gate electrode of an oxide transistor.

Abstract: Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.

Abstract: Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.