Patents by Inventor Xinlin Xie

Xinlin Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for continuously producing flexible copper clad laminates
    Patent number: 9587318
    Abstract: Method for continuously producing flexible copper clad laminates includes performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film, and performing continuous copper plating. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: March 7, 2017
    Assignee: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Xinlin Xie, Nianqun Yang
  • Method for Continuously Producing Flexible Copper Clad Laminates
    Publication number: 20130228468
    Abstract: The present invention provides a method for continuously producing flexible copper clad laminates, which comprises a step of performing continuous copper plating after the steps or step of performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method provided by the present invention is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.
    Type: Application
    Filed: May 10, 2011
    Publication date: September 5, 2013
    Applicant: ZHUHAI RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Xinlin Xie, Nianqun Yang