Patents by Inventor Xinman Mo

Xinman Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation method of a boss-type metal-based sandwich rigid-flex circuit board
    Patent number: 9942976
    Abstract: A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: April 10, 2018
    Assignees: Guangzhou Fastprint Circuit Tech Co., Ltd., Shenzhen Fastprint Circuit Tech Co., Ltd., Yixing Silicon Valley Electronics Technology Co., Ltd.
    Inventors: Bei Chen, Bo Xu, Xinman Mo
  • Boss-Type Metal-Based Sandwich Rigid-Flex Board and Preparation Method Thereof
    Publication number: 20160381783
    Abstract: A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation.
    Type: Application
    Filed: November 25, 2014
    Publication date: December 29, 2016
    Inventors: Bei Chen, Bo Xu, Xinman Mo