Patents by Inventor Xinmao Huang

Xinmao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode chip and method of manufacturing the same
    Patent number: 11621375
    Abstract: A light-emitting diode (LED) chip (2) comprises a substrate (20), an epitaxial structure (21), a transparent conductive layer (22), a passivation protective layer (23), and at least one electrode (25). The epitaxial structure (21) is disposed on the substrate (20). The transparent conductive layer (22) is disposed on the epitaxial structure (21). The transparent conductive layer (22) defines one or more first through holes (220) that extend through the transparent conductive layer (22). The passivation protective layer (23) is disposed on the transparent conductive layer (22). The passivation protective layer (23) defines one or more second through holes (230) that extend through the passivation protective layer (23). The electrode (25) is disposed on the passivation protective layer (23). The electrode (25) electrically connects the transparent conductive layer (11) through the one or more second through holes (230).
    Type: Grant
    Filed: October 7, 2017
    Date of Patent: April 4, 2023
    Assignee: Xiamen Changelight Co., Ltd.
    Inventors: Yingce Liu, Bin Song, Junxian Li, Qilong Wu, Yang Wang, Kaixuan Chen, Zhendong Wei, Xingen Wu, Hongyi Zhou, Lihe Cai, Xinmao Huang, Zhiwei Lin, Yongtong Li, Qimeng Lyu, Hexun Cai, Gengcheng Li
  • LIGHT-EMITTING DIODE CHIP AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200020830
    Abstract: A light-emitting diode (LED) chip (2) comprises a substrate (20), an epitaxial structure (21), a transparent conductive layer (22), a passivation protective layer (23), and at least one electrode (25). The epitaxial structure (21) is disposed on the substrate (20). The transparent conductive layer (22) is disposed on the epitaxial structure (21). The transparent conductive layer (22) defines one or more first through holes (220) that extend through the transparent conductive layer (22). The passivation protective layer (23) is disposed on the transparent conductive layer (22). The passivation protective layer (23) defines one or more second through holes (230) that extend through the passivation protective layer (23). The electrode (25) is disposed on the passivation protective layer (23). The electrode (25) electrically connects the transparent conductive layer (11) through the one or more second through holes (230).
    Type: Application
    Filed: October 7, 2017
    Publication date: January 16, 2020
    Inventors: Yingce LIU, Bin SONG, Junxian LI, Qilong WU, Yang WANG, Kaixuan CHEN, Zhendong WEI, Xingen WU, Hongyi ZHOU, Lihe CAI, Xinmao HUANG, Zhiwei LIN, Yongtong LI, Qimeng LYU, Hexun CAI, Gengcheng LI
  • Light-emitting diode chips with enhanced brightness
    Patent number: 10333028
    Abstract: According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 25, 2019
    Assignee: XIAMEN CHANGELIGHT CO., LTD.
    Inventors: Liang Chen, Junxian Li, Qimeng Lv, Zhendong Wei, Yingce Liu, Xiaoping Li, Xinmao Huang, Kaixuan Chen, Yong Zhang, Zhiwei Lin, Wei Jiang, Xiangjing Zhuo, Tianzu Fang
  • LIGHT-EMITTING DIODE CHIPS WITH ENHANCED BRIGHTNESS
    Publication number: 20170294557
    Abstract: According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.
    Type: Application
    Filed: April 7, 2017
    Publication date: October 12, 2017
    Inventors: Liang Chen, Junxian Li, Qimeng Lv, Zhendong Wei, Yingce Liu, Xiaoping Li, Xinmao Huang, Kaixuan Chen, Yong Zhang, Zhiwei Lin, Wei Jiang, Xiangjing Zhuo, Tianzu Fang