Abstract: A method for fabricating the three-dimensional comb-tooth-shaped groove array surface, the surface of the bearing is first etched with grooves having a certain depth by means of femtosecond lase, then a PTFE film is impressed and attached to the surface of the inner ring of the bearing, the position of a laser focus is adjusted to focus on the lower surface of the PTFE film, the same pit is scanned repeatedly, ripple characteristic stripes occur on the surface of the inner ring of the bearing while the film gasifies instantly under the action of laser ablation heating, a part of polymer material in the gasified part is adsorbed to a mechanical surface in each pit under the action of mechanical interlocking, and a super-oleophobic PTFE surface is obtained in each groove.

Abstract: A ball valve includes a valve body and a valve assembly. The valve body includes an elongated, generally tubular portion and a hydroformed stem seat. The stem seat extends generally radially from the tubular portion. The tubular portion and the stem seat are unitary. The valve assembly is coupled to the body at the stem seat.

Abstract: A ball valve includes a valve body and a valve assembly. The valve body includes an elongated, generally tubular portion and a hydroformed stem seat. The stem seat extends generally radially from the tubular portion. The tubular portion and the stem seat are unitary. The valve assembly is coupled to the body at the stem seat.

Abstract: A chip package structure including a chip, a leadframe, multiple bonding wires and an encapsulant is provided. The chip has an active surface and multiple contacts. The contacts are located on one side of the active surface. The chip is fixed under the leadframe. The leadframe has multiple first inner leads located on the active surface, and multiple second leads, wherein one end of each first inner lead and one end of each second inner lead are at near outside of one of the contacts. The bonding wires respectively connect the first inner leads and the second inner leads to the contacts. The encapsulant wraps the chip, the first inner leads, the second inner leads and the bonding wires. Because the contacts are located on one side of the active surface, the possibility of collapse of the bonding wires is reduced.

Abstract: A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.

Abstract: A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.