Patents by Inventor Xinping Shi

Xinping Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420210
    Abstract: The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 28, 2023
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Changcai ZHAO, Wei SHI, Guojun XIAO, Rong Guan, Qiang Zhao, Xinping Shi, Kangsheng Lin