Abstract: Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure having a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure having a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating layer intervening.

Abstract: Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure including a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring structure including a rewiring portion having two opposing main surfaces, and a plurality of bumps; and bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, and thereby connecting the sealing structure and the rewiring structure.

Abstract: Disclosed is a method for producing an electronic component, the method including: disposing a plurality of electronic components on an adhesive layer of a composite substrate including a support, a temporary fixing material layer, and the adhesive layer with a connection part in contact with the adhesive layer interposed between the adhesive layer and the electronic components; fixing the plurality of electronic components to the composite substrate by curing the adhesive layer; forming a sealing layer sealing the electronic components; obtaining a sealed structure by peeling off the temporary fixing material layer from the adhesive layer; and a forming a circuit surface by grinding the sealed structure from the adhesive layer side. The plurality of electronic components include an IC chip and a chip-type passive component.

Abstract: Disclosed is a method for manufacturing an electronic component including: forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material; curing the sealing resin layer; filling the via hole with a conductor precursor; and forming a conductive via by heating the conductor precursor filled in the via hole.

Abstract: Provided is a single-groove and short-tail pulling rivet and an erection method thereof, and the pulling rivet comprises a single groove and a short tail having a broached groove with a continuous and smooth cambered surface, and is characterized by easy manufacturing, low cost and convenient erection. The broached groove is an arc surface with three sections of different radiuses, which solves stress concentration and sticking of a single-groove and short-tail rivet during riveting, and allows a claw of a riveting machine to be engaged to the best position automatically. The tooth profile of a locking groove section of the rivet is a curve combining an arc and a straight line, which greatly improves fastening force.

Abstract: Provided is a single-groove and short-tail pulling rivet and an erection method thereof, and the pulling rivet comprises a single groove and a short tail having a broached groove with a continuous and smooth cambered surface, and is characterized by easy manufacturing, low cost and convenient erection. The broached groove is an arc surface with three sections of different radiuses, which solves stress concentration and sticking of a single-groove and short-tail rivet during riveting, and allows a claw of a riveting machine to be engaged to the best position automatically. The tooth profile of a locking groove section of the rivet is a curve combining an arc and a straight line, which greatly improves fastening force.

Abstract: The invention provides a method and system for operating data, which can improve efficiency of a user operating data having a tree structure. The method comprising: locating a first cache server in a distributed cache system after receiving a data operation request from a user; the first cache server constructing a cache tree in its own memory in accordance with information of relation between a file or folder and its parent directory in a relational database, the cache tree saving data below a root node corresponding to data specified by the data operation request in a tree structure; and locating a node where the data specified by the data operation request saved in the cache tree is located, and then operating the data in the node and returning an operation result to the user.