Abstract: A high-contrast display screen LED device and a manufacturing method therefor are disclosed. The LED device includes a housing including a bottom and a side wall, the bottom and the side wall forming a unit cavity with an opening; an LED chip arranged in the unit cavity; a transparent encapsulation layer covering the LED chip; a lens arranged on the encapsulation layer, a position of the lens is corresponding to a position of the LED chip; and an opaque light shield layer covering the encapsulation layer and partially wrapped around the lens; light from the LED chip is emitted after being converged by the lens.

Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

Abstract: The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

Abstract: An inorganic ultraviolet LED device, includes a bracket, a curved lens, a press ring, a wire and an ultraviolet chip. A “T”-shaped recess is formed on the upper end of the bracket. The ultraviolet chip is fixed within the recess and connected to a welding layer at the lower end of the bracket through the wire. The curved lens is placed on a step of the recess. An inclined surface is formed on a contact surface of the step contacting with the curved lens. One end of the press ring is connected to the bracket, and the other end thereof presses against the curved lens. Deformation of the press ring is implemented under a pressure action of a pressure head, thereby implementing high-strength bonding of the device. Self-positioning is achieved through a curved surface of the lens and the contact with the inclined surface of the bracket.