Abstract: An infrared pulse radiation heating method for curing board surface powder comprises melting and curing sequentially performed. The curing is to make a board, with a film formed by quickly melting a power coating, pass through a medium wave infrared pulse radiation area to be heated, the heating is performed alternatively at a high temperature and a low temperature, the medium wave infrared pulse radiation area is formed by separate medium wave infrared pulse radiation heating units consecutively arranged, and medium wave infrared heating tubes in the medium wave infrared pulse radiation area are vertically arranged. Further provided is a device for implementing the heating method. By means of the method and the device, thermal damage is prevented from being incurred to the board, the coated film is uniformly cured, and the energy-conserving effect is improved.