Abstract: A file management method includes obtaining a storage path of a file; obtaining an attribute of the file through calculation based on the storage path and an attribute prediction model; and determining a storage policy for the file based on the attribute.

Abstract: Provided is an adjustable optical assembly (900), including a bearing base (921), a driving mechanism (910), a zoom optical assembly (200), and a compensating optical assembly (300). The driving mechanism (910) includes: a bracket (911) having a bottom end connected to the bearing base (921) and a top end having a top groove (911a) open upwards; guide rods (912, 913) supported on the top groove (911a), the guide rods (912, 913) coinciding with the direction of optical axes of the zoom optical assembly (200) and the compensating optical assembly (300); a zoom bearer (914); a compensating bearer (915); a zoom driving assembly; and a compensating driving assembly. The zoom bearer (914) and the compensating bearer (915) are both mounted on the guide rods (912, 913) and slidable along the guide rods (912, 913). Also provided are a corresponding periscopic optical zoom module and an assembly method therefor.

Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board.

Abstract: The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board. The molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip. In this way, the magnitude of stress that the molded body acts on the photosensitive chip is reduced by means of the slot being disposed in the molded body, so as to effectively reduce the amount of deformation of the photosensitive chip due to the stress.

Abstract: The optical lenses include a first lenses part including a first lens and a second lenses part including a second lens. The second lens and the first lens constitute an imageable optical system. A first adhesive material is located in a first gap between the first and second lenses parts, the first adhesive material supporting and fixing the first and second lenses parts. The first lenses part has a first bottom surface, and the second lenses part has a second top surface. An adhesive applying area for arranging the first adhesive material is provided on the first bottom surface and/or the second top surface. A first adhesive blocking portion is provided on the first bottom surface and/or a third adhesive blocking portion is provided on the second top surface.