Patents by Inventor Xinxin LIAO

Xinxin LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804783
    Abstract: Embodiments of the present invention provide a heat dissipation apparatus. Wherein a loop coil is disposed on a swing plate. A first magnet and a second magnet are located on two sides of the loop coil, and when a current whose direction periodically varies flows through the loop coil, an Ampere force whose direction periodically varies is applied to the loop coil under an action of a magnetic field formed by the first magnet and the second magnet, so that the loop coil drives the swing plate to swing back and forth. The present invention is used for heat dissipation of a micro electronic component.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: October 13, 2020
    Assignees: Huawei Technologies Co., Ltd., University of Science and Technology of China
    Inventors: Zhihua Feng, Liang Li, Xinxin Liao
  • Publication number: 20190075680
    Abstract: Embodiments of the present invention provide a heat dissipation apparatus. Wherein a loop coil is disposed on a swing plate. A first magnet and a second magnet are located on two sides of the loop coil, and when a current whose direction periodically varies flows through the loop coil, an Ampere force whose direction periodically varies is applied to the loop coil under an action of a magnetic field formed by the first magnet and the second magnet, so that the loop coil drives the swing plate to swing back and forth. The present invention is used for heat dissipation of a micro electronic component.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Zhihua FENG, Liang LI, Xinxin LIAO