Patents by Inventor XIN XING BAI

XIN XING BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die sorting apparatus and die sorting method
    Patent number: 10734260
    Abstract: A die sorting apparatus includes a fixing mechanism for fixing a wafer having a plurality of dies, a positioning mechanism including an indicator for selecting a die of the wafer using die coordinates, an ejection mechanism below the wafer for applying a force to the selected die, a moving mechanism mechanically coupled to the positioning mechanism and the ejection mechanism for aligning the positioning mechanism with the ejection mechanism according to the die coordinates. The ejection mechanism includes an ejection shaft, a pin driven by the ejection shaft to apply the force to the selected die, and a pin driving device for moving the pin up and down through the ejection shaft. The die sorting apparatus also includes a die pickup device mounted in parallel to or integrated in the positioning mechanism for picking up the selected die that is separated form the wafer through the pin.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: August 4, 2020
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Chen Yang, Xin Xing Bai
  • DIE SORTING APPARATUS AND DIE SORTING METHOD
    Publication number: 20180068880
    Abstract: A die sorting apparatus includes a fixing mechanism for fixing a wafer having a plurality of dies, a positioning mechanism including an indicator for selecting a die of the wafer using die coordinates, an ejection mechanism below the wafer for applying a force to the selected die, a moving mechanism mechanically coupled to the positioning mechanism and the ejection mechanism for aligning the positioning mechanism with the ejection mechanism according to the die coordinates. The ejection mechanism includes an ejection shaft, a pin driven by the ejection shaft to apply the force to the selected die, and a pin driving device for moving the pin up and down through the ejection shaft. The die sorting apparatus also includes a die pickup device mounted in parallel to or integrated in the positioning mechanism for picking up the selected die that is separated form the wafer through the pin.
    Type: Application
    Filed: August 25, 2017
    Publication date: March 8, 2018
    Inventors: CHEN YANG, XIN XING BAI