Patents by Inventor Xinxing FAN

Xinxing FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photolithography method, method of preparing flexible substrate and photoresist drying device
    Patent number: 11249399
    Abstract: A photolithography method, a method of preparing a flexible substrate and a photoresist drying device are provided. The photolithography method includes: providing a base substrate on which a material layer to be etched is formed, in which the base substrate includes an intermediate region and a peripheral region surrounding the intermediate region; coating a layer of photoresist on the base substrate, in which the photoresist is coated in the intermediate region and the peripheral region, and is formed to cover the material layer to be etched; and drying the photoresist and simultaneously performing a first exposure process on the photoresist coated in the peripheral region.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: February 15, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cheng Tang, Zebin Sun, Zhen Zhen, Hao Zhang, Shitao Zhang, Xinxing Fan, Xudong Zhang
  • PHOTOLITHOGRAPHY METHOD, METHOD OF PREPARING FLEXIBLE SUBSTRATE AND PHOTORESIST DRYING DEVICE
    Publication number: 20200073247
    Abstract: A photolithography method, a method of preparing a flexible substrate and a photoresist drying device are provided. The photolithography method includes: providing a base substrate on which a material layer to be etched is formed, in which the base substrate includes an intermediate region and a peripheral region surrounding the intermediate region; coating a layer of photoresist on the base substrate, in which the photoresist is coated in the intermediate region and the peripheral region, and is formed to cover the material layer to be etched; and drying the photoresist and simultaneously performing a first exposure process on the photoresist coated in the peripheral region.
    Type: Application
    Filed: May 8, 2019
    Publication date: March 5, 2020
    Inventors: Cheng TANG, Zebin SUN, Zhen ZHEN, Hao ZHANG, Shitao ZHANG, Xinxing FAN, Xudong ZHANG