Patents by Inventor Xinxing Wu

Xinxing Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12623280
    Abstract: A die-casting aluminum alloy without heat-treatment and a preparation method and application thereof. Based on a total weight of the die-casting aluminum alloy, the die-casting aluminum alloy includes: 6.0 to 8.0 wt % of Si; 0.3 to 1.2 wt % of Mg; 0.4 to 0.8 wt % of Cu; 0.1 to 0.3 wt % of Fe; 0.6 to 0.8 wt % of Mn; 0.05 to 0.20 wt % of Ti; 0.03 to 0.07 wt % of Sr; 0.03 to 0.07 wt % of Ce; 0.01 to 0.04 wt % of La; 0.01 to 0.1 wt % of Zr; less than or equal to 0.01 wt % of other impurity elements; and a balance of Al.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: May 12, 2026
    Assignee: XIAOMI EV TECHNOLOGY CO., LTD.
    Inventors: Xinxing Wu, Dong Yang, Yongchang Bai
  • Publication number: 20250051885
    Abstract: A heat-treatment-free die-cast aluminum alloy includes: 10.0 to 12.0 wt % of Si, 0.9 to 1.5 wt % of Mg 2.5 to 3.5 wt % of Cu, 0.4 to 0.8 wt % of Mn, 0.9 to 1.5 wt % of Zn, 0.1 to 0.2 wt % of Ti, 0.03 to 0.06 wt % of Sr, 0.18 wt % or less of Fe, 0.15 wt % or less of a rare earth element including at least one of Sm or Y, 0.1 wt % or less of an impurity element, and a balance of Al, based on a total weight of the die-cast aluminum alloy.
    Type: Application
    Filed: August 5, 2024
    Publication date: February 13, 2025
    Inventors: Xingmeng ZHANG, Xiaodu CHEN, Tianjie CHENG, Junchuan GONG, Xinxing WU
  • Publication number: 20240139803
    Abstract: A die-casting aluminum alloy without heat-treatment and a preparation method and application thereof. Based on a total weight of the die-casting aluminum alloy, the die-casting aluminum alloy includes: 6.0 to 8.0 wt % of Si; 0.3 to 1.2 wt % of Mg; 0.4 to 0.8 wt % of Cu; 0.1 to 0.3 wt % of Fe; 0.6 to 0.8 wt % of Mn; 0.05 to 0.20 wt % of Ti; 0.03 to 0.07 wt % of Sr; 0.03 to 0.07 wt % of Ce; 0.01 to 0.04 wt % of La; 0.01 to 0.1 wt % of Zr; less than or equal to 0.01 wt % of other impurity elements; and a balance of Al.
    Type: Application
    Filed: May 30, 2023
    Publication date: May 2, 2024
    Inventors: Xinxing WU, Dong YANG, Yongchang BAI
  • Patent number: 9344895
    Abstract: A method and a system for securely accessing a portable hotspot for intelligent mobile phones, comprises an intelligent mobile phone used as an AP and another intelligent mobile phone used as an STA. The AP comprises an AP NFC module and a first data transmission module; and the STA comprises an STA NFC module and a second data transmission module. The AP uses the NFC module to perform a WPA security authentication with the STA, and uses the first data transmission module to perform data encrypted transmission with the second data transmission module. In the method and the system of the present disclosure, the common WLAN authentication mechanism is not adopted, and the security authentication process between the AP and the STA is completed in the NFC manner instead.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: May 17, 2016
    Assignee: Huizhou TC Mobile Communication Co., Ltd
    Inventors: Xiaoyong Wu, Xinxing Wu, Jinggao Zhou, Hongmei Zhu
  • Publication number: 20150065088
    Abstract: A method and a system for securely accessing a portable hotspot for intelligent mobile phones, comprises an intelligent mobile phone used as an AP and another intelligent mobile phone used as an STA. The AP comprises an AP NFC module and a first data transmission module; and the STA comprises an STA NFC module and a second data transmission module. The AP uses the NFC module to perform a WPA security authentication with the STA, and uses the first data transmission module to perform data encrypted transmission with the second data transmission module. In the method and the system of the present disclosure, the common WLAN authentication mechanism is not adopted, and the security authentication process between the AP and the STA is completed in the NFC manner instead.
    Type: Application
    Filed: June 14, 2013
    Publication date: March 5, 2015
    Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD
    Inventors: Xiaoyong Wu, Xinxing Wu, Jinggao Zhou, Hongmei Zhu
  • Patent number: D1052553
    Type: Grant
    Filed: June 13, 2024
    Date of Patent: November 26, 2024
    Inventor: Xinxing Wu
  • Patent number: D1068853
    Type: Grant
    Filed: July 30, 2024
    Date of Patent: April 1, 2025
    Inventor: Xinxing Wu