Abstract: The present disclosure relates to silver paste, and a preparation method and a use thereof, which belong to the field of device packaging technology. The silver paste of the present disclosure is prepared by a silver-ammonia complex and an aldehyde-containing organic solvent, wherein a molar ratio of the silver-ammonia complex to the aldehyde-containing organic solvent is in a range of from 1:1 to 1:5; the silver-ammonia complex is prepared by a silver ?-ketocarboxylate and an amino-containing organic solvent; and a molar ratio of the silver ?-ketocarboxylate to the amino-containing organic solvent is in a range of from 1:1 to 1:5. The silver paste of the present disclosure can achieve large-area (?30×30 cm2) packaging and interconnection of a wide-bandgap semiconductor device within 300° C. under a low pressure (?1 MPa) or without pressures.