Patents by Inventor Xinyao WU

Xinyao WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-port silicon beam splitter chip and its fabrication method
    Patent number: 11500218
    Abstract: A three-port silicon beam splitter chip includes an input waveguide, three output waveguides, and a coupling region disposed between the input waveguide and the output waveguides and being in a square shape. The input waveguide and the output waveguide have a same width K, where 490 nm<K<510 nm, the coupling region, the input waveguide and the output waveguide have a same thickness H, where 210 nm<H<230 nm, and the coupling region has a length L, where 1600 nm<L<2000 nm. The three-port silicon beam splitter chip of the present disclosure has a high integration degree and a small size, and is capable of improving the portability of the wavefront reconstruction device.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 15, 2022
    Assignees: CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY, UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY, EAST CHINA NORMAL UNIVERSITY
    Inventors: Heping Zeng, Jijun Feng, Xinyao Wu
  • THREE-PORT SILICON BEAM SPLITTER CHIP AND ITS FABRICATION METHOD
    Publication number: 20210132401
    Abstract: A three-port silicon beam splitter chip includes an input waveguide, three output waveguides, and a coupling region disposed between the input waveguide and the output waveguides and being in a square shape. The input waveguide and the output waveguide have a same width K, where 490 nm<K<510 nm, the coupling region, the input waveguide and the output waveguide have a same thickness H, where 210 nm<H<230 nm, and the coupling region has a length L, where 1600 nm<L<2000 nm. The three-port silicon beam splitter chip of the present disclosure has a high integration degree and a small size, and is capable of improving the portability of the wavefront reconstruction device.
    Type: Application
    Filed: September 30, 2020
    Publication date: May 6, 2021
    Inventors: Heping ZENG, Jijun FENG, Xinyao WU