Patents by Inventor Xinyi LU

Xinyi LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250115697
    Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided. Printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cP at 70° which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. The curable precursor formulation exhibits an ultimate tensile strength measured in mPa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 10, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Xinyi Lu, SeyedMahmoud Hosseini, Sudhakar Madhusoodhanan, Srikant Pathak
  • Publication number: 20250115698
    Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided. Printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cP at 70° which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. The curable precursor formulation exhibits an ultimate tensile strength measured in mPa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 10, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Xinyi Lu, SeyedMahmoud Hosseini, Sudhakar Madhusoodhanan, Srikant Pathak
  • Publication number: 20250112038
    Abstract: Exemplary semiconductor processing methods may include providing deposition precursors to a processing region of a semiconductor processing chamber. The deposition precursors may include a silicon-carbon-and-nitrogen-containing precursor. A substrate may be disposed within the processing region. The methods may include forming plasma effluents of the deposition precursors. The methods may include depositing a layer of silicon-carbon-and-nitrogen-containing material on the substrate. The layer of silicon-carbon-and-nitrogen-containing material may be characterized by a dielectric constant of less than or about 4.0. The layer of silicon-carbon-and-nitrogen-containing material may be characterized by a leakage current at 2 MV/cm of less than or about 3E-08 A/cm2.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 3, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Shanshan Yao, Xinyi Lu, Bo Xie, Chi-I Lang, Li-Qun Xia
  • Publication number: 20250034296
    Abstract: Polishing pads having porogen-features, methods of manufacturing polishing pads having porogen features, and compositions for manufacturing polishing pads having porogen features, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing are provided. In one aspect, the porogen-forming composition, in proportions based on a total weight of the porogen-forming composition, includes (A) from about 60 to about 80 wt. % of an acrylamide monomer compound selected from acryloylmorpholine, N, N-dimethylacrylamide, or a combination thereof. The curable porogen-forming composition further includes (B) from about 10 to about 40 wt. % of a polyhydroxy compound having two or more hydroxyl groups. The curable porogen-forming composition further includes (C) from about 0.2 wt. % to about 4 wt. % of a photoinitiator component.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Inventors: Xinyi LU, Srikant PATHAK, Sudhakar MADHUSOODHANAN
  • Publication number: 20240227120
    Abstract: The disclosure generally relates to polishing pads, methods of manufacturing polishing pads, and formulations for manufacturing polishing pads, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing. In one aspect, a photocurable printing composition containing photopolymerizable compounds and photopolymerization initiator is provided. The photocurable printing composition comprises a urethane acrylate oligomer having a functionality of 2 or more, a nominal viscosity greater than 20,000 cP at 60 degrees Celsius, and a glass transition temperature (Tg) of ?4 degrees Celsius or greater, the urethane acrylate oligomer present from about 20% to about 60% by weight based on a total weight of the photopolymerizable compounds. The photocurable printing composition has a viscosity of 20 centipoise or higher at 70 degrees Celsius.
    Type: Application
    Filed: June 1, 2023
    Publication date: July 11, 2024
    Inventors: Sudhakar MADHUSOODHANAN, Xinyi LU, Srikant PATHAK
  • Patent number: 11615615
    Abstract: The present invention discloses a method and an apparatus for extracting mountain landscape buildings based on high-resolution remote sensing images. The method comprises: segmenting a remote sensing image, and extracting non-vegetation areas from the remote sensing image by using NDVI; segmenting the non-vegetation areas, and extracting building areas by using NDBI; segmenting the building areas again, and calculating a normalized difference build shadow index NSBI of each patch; calculating NSBI separator of each patch in the non-vegetation areas and setting a separator threshold, and extracting landscape building areas based on the threshold. In the present invention, by introducing a near infrared band in the remote sensing image spectrum, in which there is a significant difference between shadows and non-shadows, the influence of large shadow areas in mountainous shady areas in the remote sensing image on the result of extraction is reduced.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: March 28, 2023
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Zhe Li, Yukun He, Yuning Cheng, Xiang Zhou, Kaiyu Zhao, Xiao Han, Feifei Chen, Shuang Song, Xinyi Lu, Xiaoshan Lin
  • Publication number: 20210166020
    Abstract: The present invention discloses a method and an apparatus for extracting mountain landscape buildings based on high-resolution remote sensing images. The method comprises: segmenting a remote sensing image, and extracting non-vegetation areas from the remote sensing image by using NDVI; segmenting the non-vegetation areas, and extracting building areas by using NDBI; segmenting the building areas again, and calculating a normalized difference build shadow index NSBI of each patch; calculating NSBI separator of each patch in the non-vegetation areas and setting a separator threshold, and extracting landscape building areas based on the threshold. In the present invention, by introducing a near infrared band in the remote sensing image spectrum, in which there is a significant difference between shadows and non-shadows, the influence of large shadow areas in mountainous shady areas in the remote sensing image on the result of extraction is reduced.
    Type: Application
    Filed: January 21, 2021
    Publication date: June 3, 2021
    Inventors: Zhe LI, Yukun HE, Yuning CHENG, Xiang ZHOU, Kaiyu ZHAO, Xiao HAN, Feifei CHEN, Shuang SONG, Xinyi LU, Xiaoshan LIN