Patents by Inventor Xinyu Dou

Xinyu Dou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050181841
    Abstract: A cellular telephone (100, 1300) comprises an earpiece speaker (234, 1312) and a loudspeaker (238, 1316) that share a common resonator (e.g., 1436). Sharing a common resonator allows the common resonator to be made large thereby improving bass response. Undesirable acoustic coupling through the common resonator is addressed by driving the earpiece speaker with a cancellation filtered version of the loudspeaker drive signal when the loudspeaker is driven.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 18, 2005
    Inventor: Xinyu Dou
  • Publication number: 20030044002
    Abstract: A method for creating spatially resolved audio signals for a listener (18) that are representative of one or more callers (12, 14, 16). A digital data signal (13) that represents the individual caller's voice (12) contains an embedded tag (24) that is identifiable with the individual caller. The digital data signal is transmitted from a sending device at the caller's location to a receiving device (30) at the listener's location. At the listener's receiving device, the tag is used to associate each of the digital data signals with a head related transfer functions (32) that are resident in the receiving device by consulting a lookup table. The digital data streams are then convolved (34) with the associated head related transfer function to form binaural digital signals, which are ported to two or more acoustic transducers (36) to create analog audio signals that appear to emanate from different spatial locations around the listener.
    Type: Application
    Filed: August 28, 2001
    Publication date: March 6, 2003
    Inventors: David M. Yeager, Scott K. Isabelle, Karl F. Mueller, Sivakumar Muthuswamy, Xinyu Dou
  • Patent number: 5930276
    Abstract: The present invention provides a method (600) and device (200,500) for providing temperature-stable optical feedback for optical packages. The device includes an optical emitter (202,502), a first partially reflective optical element (204, 504), a second partially reflective optical element (206,506), a first optical sensing unit (208,508), a second optical sensing unit (210,510), and a feedback unit (212). The optical emitter (202,502) is responsive to an electrical input current and generates a beam of light (214). The first optical sensing unit (208,508) and the second optical sensing unit (210,510) receive diffracted portions of the beam of light (214) from the first partially reflective optical element (204, 504) and the second partially reflective optical element (206,506) respectively and generate a first feedback signal E1 and a second feedback signal E2.
    Type: Grant
    Filed: December 29, 1997
    Date of Patent: July 27, 1999
    Assignee: Motrola, Inc.
    Inventors: Xinyu Dou, Chao-pin Yeh, Karl Wyatt
  • Patent number: 5905803
    Abstract: The present invention provides a method (600) and device (400) for minimizing wind-induced noise in a microphone. The device includes: a housing (412) having a recessed area shaped to accommodate a microphone transducer (410); the microphone transducer (410), situated within the recessed area such that a thin film situated over the microphone transducer is flush with/overlaying a top of the recessed area and affixed at least to the sides of the recessed area, for receiving sound; and the thin film (402) has at least one aperture (404, . . . 406) for allowing sound to impinge on the microphone transducer (410), and has a minimal thickness that maintains structural integrity.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: May 18, 1999
    Assignee: Motorola, Inc.
    Inventors: Xinyu Dou, Julio Castaneda, Xiaohua Wu, David Zak, Chao-pin Yeh, Karl W. Wyatt
  • Patent number: 5831218
    Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: November 3, 1998
    Assignee: Motorola, Inc.
    Inventors: Kai X. Hu, Xinyu Dou, Chao-Pin Yeh, Don Dillard, Delbert Juarezl, Gary Mui, Tom Brey, Rich Dlesk, Karl Wyatt, Dave Roller