Abstract: An information handling system may include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide may include one or more features configured to, either alone or in combination with portions of a chassis of the information handling system, form an air plenum fluidically coupled between the air mover and the heat-generating information handling resource and electrical conduits integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.

Abstract: An information handling system includes a memory and a processor. The memory stores data associated with cooling fans and other components within the information handling system. The processor receives a first set of data for a baseline cooling condition within the information handling system, and a second set of data for a current cooling condition. The processor determines whether a first subset of data in the first set of data is substantially equal to a second subset of data in the second set of data. If so, the processor determines whether a baseline device temperature is substantially equal to a current device temperature. If not, the processor determines a first degradation issue within the information handling system based on cooling fans in a first fan zone are operating at full speed, and both a first device temperature increases and a downstream components temperature increase.

Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

Abstract: A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.

Abstract: A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.