Abstract: An adaptive temperature control system, including a computing component; an internal heat sink coupled to the computing component; a TEC in thermal communication with the internal heat sink; an external heat sink including a casing surrounding the computing component, the internal heat sink, and the TEC; a sensor configured to detect a temperature of the computing component; a processor having access to memory media storing instructions executable by the processor to perform operations, comprising: comparing the temperature of the computing component to a first threshold; determining that the temperature of the computing component is greater than a first threshold; in response to determining that the temperature of the computing component is greater than the first threshold: adjusting a temperature control mode of the TEC such that heat transferred from the computing component to the TEC through the internal heat sink is transferred to the external heat sink by the TEC.

Abstract: In one or more embodiments, a liquid cooling system may include one or more air-assist modules (AAMs) for reducing the amount of liquid coolant needed to cool information handling systems immersed in the coolant. A controller communicatively coupled to a coolant pump, an inflation pump, a deflation valve and a coolant level sensor may determine when to add liquid coolant as well as when to increase or decrease the amount of air in the one or more air-assist modules based on the level of liquid coolant and a temperature of the coolant.

Abstract: In an information handling system, positions of a plurality of mechanical structures may be configured to be controlled to selectively direct airflow cooled by first heat-rejecting media and a thermoelectric cooler between flowing through the first exhaust plenum and flowing proximate to the one or more information handling resources and selectively direct airflow heated by the second heat-rejecting media and the thermoelectric cooler between flowing through the second exhaust plenum and flowing proximate to the one or more information handling resources.

Abstract: Managing thermal capabilities of an information handling system, including identifying a maximum supported ambient temperature of the information handling system; identifying a current ambient temperature of the information handling system; calculating a temperature delta based on the maximum supported ambient temperature of the information handling system and the current ambient temperature of the information handling system; adjusting, based on the temperature delta, one or more thermal control trigger points; adjusting, based on the adjusted thermal control trigger points, a fan speed of a fan of the information handling system; and determining, based on the adjusted fan speed of the fan, an updated cooling capacity associated with the information handling system.

Abstract: An information handling system may include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide may include one or more features configured to, either alone or in combination with portions of a chassis of the information handling system, form an air plenum fluidically coupled between the air mover and the heat-generating information handling resource and electrical conduits integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.

Abstract: A connector configured to couple to a second connector may include a first set of pins, each of the first set of pins coupled to a corresponding first signal, and a second set of pins, each of the second set of pins coupled to a corresponding second signal conductor. The first and second set of pins may be arranged relative to one another such that when the connector and the second connector are coupled to one another in a first position relative to one another, each of the first set of pins electrically couples to a corresponding pin of a plurality of pins of the second connector and when the connector and the second connector are coupled to one another in a second position relative to one another, each of the second set of pins electrically couples to a corresponding pin of a plurality of pins of the second connector.

Abstract: In an information handling system, positions of a plurality of mechanical structures may be configured to be controlled to selectively direct airflow cooled by first heat-rejecting media and a thermoelectric cooler between flowing through the first exhaust plenum and flowing proximate to the one or more information handling resources and selectively direct airflow heated by the second heat-rejecting media and the thermoelectric cooler between flowing through the second exhaust plenum and flowing proximate to the one or more information handling resources.

Abstract: An information handling system may include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide may include one or more features configured to, either alone or in combination with portions of a chassis of the information handling system, form an air plenum fluidically coupled between the air mover and the heat-generating information handling resource and electrical conduits integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.

Abstract: An information handling system includes a memory and a processor. The memory stores data associated with cooling fans and other components within the information handling system. The processor receives a first set of data for a baseline cooling condition within the information handling system, and a second set of data for a current cooling condition. The processor determines whether a first subset of data in the first set of data is substantially equal to a second subset of data in the second set of data. If so, the processor determines whether a baseline device temperature is substantially equal to a current device temperature. If not, the processor determines a first degradation issue within the information handling system based on cooling fans in a first fan zone are operating at full speed, and both a first device temperature increases and a downstream components temperature increase.

Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

Abstract: A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.

Abstract: A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.