Patents by Inventor Xio Hu Liu

Xio Hu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7573130
    Abstract: The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: August 11, 2009
    Assignee: Internatonal Business Machines Corporation
    Inventors: Thomas M Shaw, Michael W Lane, Xio Hu Liu, Griselda Bonilla, James P Doyle, Howard S Landis, Eric G Liniger
  • Patent number: 7491578
    Abstract: The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: February 17, 2009
    Assignee: International Business Machines Corporation
    Inventors: Thomas M Shaw, Michael W Lane, Xio Hu Liu, Griselda Bonilla, James P Doyle, Howard S Landis, Eric G Liniger