Patents by Inventor Xiongbiao Liu

Xiongbiao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160005515
    Abstract: A cable assembly calibration apparatus includes multiple cables and connectors placed at two end sides of the cables; the cable assembly calibration apparatus includes a calibration block and a calibration board that can perform calibration and positioning on the cable assembly in both an X direction and a Y direction; the calibration block is disposed at one end side, provided with the connector, of the cable assembly, and the calibration board is disposed at the other end side, opposite to the calibration block, of the cable assembly; and a convex structure or a concave structure is disposed on all surfaces, opposite to the cable assembly, of the calibration block and the calibration board, and the convex structure or the concave structure fits a calibration feature on the cable assembly to fasten the cable assembly.
    Type: Application
    Filed: September 17, 2015
    Publication date: January 7, 2016
    Inventors: Na Wei, Xiongbiao Liu, Lei Bai
  • Patent number: 8842441
    Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: September 23, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lei Bai, Xiongbiao Liu, Lexiong Peng
  • Publication number: 20140220795
    Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.
    Type: Application
    Filed: December 11, 2013
    Publication date: August 7, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Lei Bai, Xiongbiao Liu, Lexiong Peng