Patents by Inventor Xiongcai Kuang

Xiongcai Kuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip die package structure and electronic device
    Patent number: 11251136
    Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: February 15, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wei Wu, Ding Li, Hongcheng Yin, Xiongcai Kuang
  • Flip-Chip Die Package Structure and Electronic Device
    Publication number: 20210013154
    Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Inventors: Wei Wu, Ding Li, Hongcheng Yin, Xiongcai Kuang