Patents by Inventor Xipeng LUAN

Xipeng LUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240057277
    Abstract: A memory case includes a first case body and a second case body. The first case body includes a first extension part extending in a first direction, and the second case body includes a second extension part extending in the first direction. The first case body and the second case body are combined in a second direction to form an interior space for accommodating a memory, and the first extension part secures the second extension part. A length of the first case body in a third direction is different from a length of the second case body in the third direction. The memory module of the server includes a memory slot, a memory, and the above-mentioned memory case. The memory is mounted on the memory slot, and the memory case accommodates the memory.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 15, 2024
    Inventors: Zhihua MA, Haiquan LI, Xipeng LUAN
  • Publication number: 20240057282
    Abstract: Disclosed is a server. The server includes a housing, a support module, a heat-generating element set, and a heat dissipating unit. The housing defines an interior space, and the support module is positioned in the interior space. The heat-generating element set includes a central processing unit and a memory module. The heat dissipating unit includes a heat sink and a fan set. The heat sink and the support module divide the interior space into a first space and a second space. The heat-generating element set is located in the first space. A first surface of the heat sink contacts the heat-generating element set to dissipate heat from the heat-generating element set. The fan set is provided at a position of the housing corresponding to the second space to dissipate heat from the second space. This server can achieve efficient heat dissipation while ensuring the dustproof effect and structural stability.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 15, 2024
    Inventors: Zhihua MA, Haiquan LI, Xipeng LUAN